Osram Opto Semiconductors Gmbh

Osram Opto Semiconductor Gmbh

Marcus Ruhnau

Bert Braune

Georg Bogner

Patrick Kromotis

An optoelectronic component having a basic housing or frame and at least one semiconductor chip, specifically a radiation-emitting or -receiving semiconductor chip, in a cavity of the basic housing. In order to increase the efficiency of the optoelectronic component, reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound filled at least partly into the cavity is provided, the material and the quantity of the filling compound being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas of the filling compound serve as reflector.

Optoelectronic component

An optoelectronic component having a basic housing or frame and at least one semiconductor chip, specifically a radiation-emitting or-receiving semiconductor chip, in a cavity of the basic housing. In order to increase the efficiency of the optoelectronic component, reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound filled at least partly into the cavity is provided, the material and the quantity of the filling compound being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas of the filling compound serve as reflector.

An optoelectronic component having a basic housing or frame () and at least one semiconductor chip (), specifically a radiation-emitting or -receiving semiconductor chip, in a cavity () of the basic housing. In order to increase the efficiency of the optoelectronic component (), reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound () filled at least partly into the cavity () is provided, the material and the quantity of the filling compound () being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas () of the filling compound serve as reflector.

Optoelectronic component and method for producing it

The invention relates to a wavelength-converting reaction resin compound into which a wavelength-converting luminescent material and a thixotroping agent are mixed, wherein the luminescent material contains inorganic luminescent particles. The thixotroping agent is present, at least in part, in the form of nanoparticles. Methods of producing the reaction resin compound and light-emitting diode elements having such reaction resin compounds are indicated.

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Weiding, Germany

Marcus Ruhnau