Eagle Technology, LLC

Marcus Ni

Jason Thompson

Voi Nguyen

An electronic device may include a circuit board, a heat generating component carried by the circuit board, a heat sink body, and a heat transfer assembly between the heat generating component and the heat sink body. The heat transfer assembly may include a flexible, heat conductive layer having a first portion in thermal contact with the heat generating component and a second portion in thermal contact with the heat sink body. The first and second portions are thermally coupled, and a compressible layer is between the first and second portions of the flexible, heat conductive layer.

Electronic device having flexible, heat conductive layer and associated methods

An electronic device may include a circuit board, a heat generating component carried by the circuit board, a heat transfer rail extending along an edge of circuit board and coupled to the heat generating component, a housing covering the circuit board, and a heat transfer clamp between the heat transfer rail and the housing. The heat transfer clamp includes a flexible, heat conductive layer having a first portion in thermal contact with the heat transfer rail and a second portion in thermal contact with the housing. The first and second portions are thermally coupled, and a clamp and a compressible layer thereon extends between the first and second portions of the flexible, heat conductive layer.

Electronic device having heat transfer clamp and associated methods

An electronic device may include a backplane and an electrical connector carried by a front side of the backplane, and a circuit board assembly removably coupled to the electrical connector. Each circuit board assembly may include a circuit board and electronic components carried by the circuit board and generating waste heat, and a cooling fluid arrangement thermally coupled to the electronic components. The electronic device may include a cooling fluid manifold, and a pair of multi-functional tubes that provide alignment, keying, structural rigidity and fluid supply and return capabilities extending between the cooling fluid manifold and the cooling fluid arrangement.

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Rockledge, FL, United States of America

Marcus Ni