Bae Systems Information and Electronic Systems Integration Inc.

Lockheed Martin Ir Imaging Systems, Inc.

Marcus Hatch

Curtis A Vock

Michael J Choiniere

Neal R Butler

Michael A Martinelli

Kenneth R Erikson

Wayne C Haase

Timothy E White

Raymond J Silva

William E Shaw

Michael E DeFlumere

James R Lynch, Iii

Carl Alan Way

Bruce Whaley

Chris M Bower

James R Iii Lynch

A fiber optically coupled laser rangefinder (LRF) for use in a gimbal system to input/extract a laser beam into/from a camera is disclosed. In one embodiment, the fiber optically coupled LRF includes a gimbal assembly. Further, the gimbal assembly includes a first fiber optic cable for receiving the laser beam from a remote transmitter assembly, a fiber optically coupled laser interface module to receive the laser beam and opposing mirrors to direct the laser beam to a target. In addition, the gimbal assembly includes a second fiber optic cable for transmitting a return laser beam to a remote receiver assembly. The opposing mirrors are further configured to direct the return laser beam from the target to the fiber optically coupled laser interface module. The fiber optically coupled laser interface module is further configured to transmit it to the receiver assembly via the second fiber optic cable.

Fiber optically coupled laser rangefinder for use in a gimbal systems

An optic assembly is provided, that assembly comprising: a bullet collection lens; a plurality of fiber optic fiber bundles; and those fiber optic bundles being parallel to a central channel.

Bullet lens design for the dasal seeker

An array of ultrasonic transducers, where each of the ultrasonic transducers has a matching layer end and a driving layer/individually isolated end. A bump bond connects each one of the ultrasonic transducers to a substrate. A high voltage electrical conductor is connected to at least one driving layer/individually isolated end to provide a drive signal to at least one of the ultrasonic transducers. A conductive/matching layer is disposed to electrically connect each matching layer end. An outer matching layer is connected to the conductive/matching layer. The bump bond is an indium or solder bump bond having a contact area for contact with an ultrasonic transducer less than 20 percent of the driving layer/individually isolated end for the contacted ultrasonic transducer so as to provide mechanical stability while reducing cross talk among the plurality of ultrasonic transducers.

Ultrasonic array with attenuating electrical interconnects

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Waltham, MA, United States of America

Marcus Hatch