Conti Temic Microelectronic Gmbh

Multitest Elektronische Systeme Gmbh

Marcus Frey

Bernhard Schmid

Helmut Seidel

Manuel Petermann

Gerhard Gschwendtberger

Matthias Aikele

Volker Leikermoser

Albert Engelhardt

A contact spring for a testing base for high current testing of an electronic component, which is produced from a spring metal sheet of a predetermined thickness and possesses two identical opposing lateral faces, and which has a spring arm and a testing arm with a testing tip, where the testing arm forms an angle with the spring arm, which enables the testing tip to be positioned on a contact surface of the electronic component running approximately parallel to the spring arm, by relative movement between the testing base and the electronic component.

Contact spring for a testing base for the high current testing of an electronic component

To form an isolation structure in a semiconductor substrate, at least two trenches are formed with a rib therebetween in the semiconductor substrate, and then the semiconductor material in the area of the trenches and particularly the rib is converted to an electrically insulating material. For example, this is accomplished by thermal oxidation of silicon semiconductor material of the rib.

Method for producing insulation structures

Growing community of inventors

Bernau, Germany

Marcus Frey