Lumileds LLC

Koninklijke Philips Corporation N.v.

Nxp B.v.

Medtronic Bakken Research Center B.v.

Towa Intercon Technology, Inc.

Marcus Franciscus Donker

Paul Dijkstra

Axel Mehnert

Boudewijn Ruben De Jong

Lu Fei Zhang

Dusan Golubovic

Hendrik Jan Eggink

Rene Van Honschooten

Aernout Reints Bok

Theodoor Cornelis Treurniet

Pascal Johannes Theodorus Lambertus Oberndorff

Johannes Wilhelmus Weekamp

Michel Marcel Jose Decre

Egbertus Reinier Jacobs

Teang K Khor

Leonardus A E Gemert

Leonardus A E Van Gemert

Chris Mihai

A device is provided that comprises a metallic substrate defining a plurality of openings, the openings having a first area. The openings form one or more heat dissipating elements having a second area. The device comprises a plurality of sites on a surface of the one or more heat dissipating elements. Each site is configured to receive a light emitting element. The device comprises a plurality of conductor elements having a third area. The conductor elements are physically separated from the one or more heat dissipating elements by the openings. The conductor elements are configured to enable electrical connections to the light emitting elements and are electrically isolated from the one or more heat dissipating elements.

LED package with integrated features for gas or liquid cooling

In one example, a medical device system for at least one of delivery of electrical stimulation pulses or sensing of physiological signals, the system including an elongated carrier; and a thin film wound around the elongated carrier, wherein the thin film includes a plurality of electrical contacts, a plurality of electrodes located distal to the plurality of electrical contacts, and a plurality of conducting tracks, each of the plurality of conducting tracks providing an electrical connection between at least one of the plurality of electrodes and one of the plurality of electrical contacts, and wherein the thin film is wound around the elongated carrier from the distal end of the elongated film to the proximal end of the elongated thin film.

Lead and a system for medical applications

A packaged light emitting device dieincludes a package body having a profiled leadframeembedded in a bodyof reflecting material. The leadframeis exposed on mounting surfaceonly on at least one solder bonding area. Solderis present only on the at least one solder bonding areaand not elsewhere. The reflecting material provides the reflecting parts of the package so there is no need for a reflective layer to be deposited on leadframe. Moreover, the reflecting material can function as a solder resist to self-align the solderto the at least one solder bonding area

Light emitting device package

A light emitting device is provided that includes an integral heat dissipation element. This heat dissipation element is included in the leadframe that is used to facilitate fabrication of the light emitting device, to provide a single common substrate that forms both the heat dissipation element and the conductive elements for coupling the light emitting device to external sources of power. The heat dissipation element may extend beyond the protective structure that surrounds the light emitting element to facilitate heat dissipation to the surrounding medium.

A packaged light emitting device die includes a package body having a profiled leadframe embedded in a body of reflecting material. The leadframe is exposed on mounting surface only on at least one solder bonding area. Solder is present only on the at least one solder bonding area and not elsewhere. The reflecting material provides the reflecting parts of the package so there is no need for a reflective layer to be deposited on leadframe. Moreover, the reflecting material can function as a solder resist to self-align the solder to the at least one solder bonding area.

The package comprises a chip and a plurality of frame contact pads. The chip is attached to the frame contact pads in a die attach area with a die attach adhesive. The chips is coupled to frame contact pads outside the die attach area with connecting elements. The chip, the connecting elements and the frame contact pads outside the die attach area are anchored in an electrically insulating encapsulation. The frame contact pads each comprise a first patterned layer and a second patterned layer, which second layer has the surface that is exposed outside the encapsulation. At least a portion of the frame contact pads in the die attach area has a first patterned layer with a first pattern that comprises at least one flange/lead that is outside the second patterned layer when seen in perpendicular projection of the first layer on the second layer.

Package, method of manufacturing a package and frame

Improved systems and methods for singulating a substrate into a plurality of integrated circuit devices are disclosed. One aspect of the invention corresponds to a fixture that holds the substrate during the dicing process. Another aspect of the invention pertains to a nozzle assembly that provides better fluid flow over the cutting blades. Another aspect of the invention corresponds to a nozzle adjustment assembly that helps position the nozzles relative to the blades. Another aspect of the invention corresponds to spacers that reduce the problem of imbalance caused by fluid retained therein. Yet another aspect pertains to the composition of the fluid, which is distributed by the nozzle assembly to the blades.

Saw singulation

Growing community of inventors

Wijchen, Netherlands

Marcus Franciscus Donker