Cisco Technology, Inc.

Marcus C Chan

Chejung Liu

Allison T Yuan

Elias Khamisy

Hayden W Farriester

Providing cooling airflow through an electronic device is described. The electronic device incudes a heat source, an airflow enclosure, an insulation layer, and a directional structure. The airflow enclosure is on a first side of the insulation layer and the heat source is on a second side of the insulation layer. The insulation layer includes at least one directional opening that is adjacent to the heat source. The directional structure is positioned on the second side of the insulation to provide a directed cooling airflow path from the at least one directional opening to the heat source.

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Hacienda Heights, CA, United States of America

Marcus C Chan