Infineon Technologies Ag

Osram Oled Gmbh

Marcus Boehm

Frank Singer

Martin Gruber

Andreas Grassmann

Martin Strassburg

Britta Goeoetz

Ludwig Heitzer

Stefan Woetzel

Uwe Schindler

Michael Fuegl

A method for producing an optoelectronic semiconductor component and an optoelectronic component are disclosed. In an embodiment a method includes providing an optoelectronic semiconductor chip comprising at least one light-emitting layer and at least one cavity and introducing at least one precursor of a conversion element in the at least one cavity, wherein the at least one conversion element comprises a perovskite-based ABXor ABB'Xstructure.

μLED chip architecture based on nanostructured perovskite converter materials

A molded semiconductor package includes: a mold compound; a metal substrate partly embedded in the mold compound; at least one first metal lead partly embedded in the mold compound; an inlay embedded in the mold compound, the inlay comprising a semiconductor die embedded in an electrically insulating body, a first metal structure attached to a first side of the semiconductor die, and a second metal structure attached to a second side of the semiconductor die; and a metal clip at least partly embedded in the mold compound and connecting the second metal structure to the at least one first metal lead. The semiconductor die has a maximum junction temperature higher than a glass transition temperature of the mold compound, the electrically insulating body has a glass transition temperature at or above the maximum junction temperature of the semiconductor die, and the metal substrate is attached to the first metal structure.

Molded semiconductor package having an embedded inlay

A package includes a carrier, an electronic component on the carrier, an encapsulant encapsulating at least part of the carrier and the electronic component, and at least one lead extending beyond the encapsulant and having a punched surface, wherein at least part of at least one side flank of the encapsulant has a sawn texture.

Leadframe, encapsulated package with punched lead and sawn side flanks, and corresponding manufacturing method

Growing community of inventors

Thalmassing, Germany

Marcus Boehm