Applied Materials, Inc.

Applied Materials Gmbh & Co Kg

Applied Films Gmbh & Co. Kg

Marcus Bender

Jose Manuel Dieguez-Campo

Andreas Lopp

Stefan Keller

Uwe Hoffmann

Frank Schnappenberger

Markus Hanika

Fabio Pieralisi

Ralph Lindenberg

Anke Hellmich

Evelyn Scheer

Guido Mahnke

Manfred Schreil

Jian Liu

An AC power connector for connecting an AC power supply with a device is provided. The AC power connector includes at least one first element connectable with the AC power supply and at least one second element connectable with the device, the first element and the second elements being arranged at a first distance with respect to each other for defining a capacitance, wherein the at least one first element and the at least one second element are rotatable with respect to each other, wherein the first element and the second element are configured for a transfer of an AC power between the at least one first element and the at least one second element.

AC power connector, sputtering apparatus and method therefor

A method of producing a semiconductor device is provided, the semiconductor device including a substrate, a semiconductor layer and at least one metallization layer adjacent to at least one element chosen from the substrate and the semiconductor layer, the method including forming at least one metallization layer which, adjacent to at least one element chosen from the substrate and the semiconductor layer, includes oxygen.

Method and installation for producing a semiconductor device, and semiconductor device

The invention relates to an arrangement for the coating of substrates, which comprises an evaporation source and a vapor barrier between the evaporation source and the substrate. The vapor barrier is maintained at a temperature which is at least equal to or above the vaporization temperature of the material to be vaporized. The vapor barrier is implemented as a quartz valve, which includes a spherical closure part connected with a movable rod. In a first position this spherical closure part closes a vapor conducting tube, which is connected with the evaporation source, and, in a second position, the spherical closure part abuts a spherical calotte which seals off a quartz tube.

Arrangement for coating a substrate

In a method for producing ITO layers on substrates, especially for the production of organic light-emitting diodes, part of the ITO layer thickness is applied first by sputter-deposition, at a controlled temperature profile, in such manner that the formation of crystallization nuclei is prevented; subsequently, the partially coated substrate is heated to a temperature above the recrystallization temperature of the ITO layer, and then the rest of the ITO layer is sputter-deposited.

Method for producing smooth indium-tin-oxide layers on substrates and a substrate coating of indium-tin-oxide

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Hanau, Germany

Marcus Bender