Sicpa Holding Sa

Marco Sarti

Silvano Tori

Tazio Sandri

Alessandro Scardovi

Lucia Giovanola

Paolo Cappello

A multi-chip module (MCM) assembly comprising: a graphite substrate having a front surface and a back surface and comprising a plurality of silicon chips mounted on the front surface, a Printed Wiring Board (PWB) attached to the graphite substrate and provided with openings surrounding outer profiles of the silicon chips, the graphite substrate comprises one or more ink channels on the back surface and one or more ink feeding slots passing through the graphite substrate and being in fluidic communication with the respective one or more ink channels, so that each of the silicon chips can be fed with one or more different types of inks, the MCM assembly further comprises a graphite cover plate configured to cover the one or more ink channels of the graphite substrate.

Multi-chip module (MCM) assembly

A multi-chip module (MCM) assembly comprising: a graphite substrate comprising a plurality of silicon chips directly attached to the graphite substrate, and a Printed Wiring Board (PWB) attached to the graphite substrate by means of a solvent-resistant adhesive glue and provided with openings surrounding outer profiles of the silicon chips. A printing bar comprising a plurality of the MCM assemblies is also disclosed.

Multi-chip module (MCM) assembly and a printing bar

An ink delivery system for at least one printing module comprising a closed-loop ink recirculation circuit and a vacuum discharge circuit, which is configured to produce a vacuum condition in the at least one printing module. A method for delivering ink to the at least one printing module is also disclosed.

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Turin, Italy

Marco Sarti