Dyconex Patente Ag

Dyconex Ag

Dyconex Pantente Ag

Marco Martinelli

Walter Schmidt

Alexandra S Frei

A method for the manufacture of screened or shielded interconnecting conductors ( ) begins with semifinished foil products (H H H ), a first semifinished foil product (H ) having at least one layer of conductors ( &prime;) including signal conductors ( &prime;) and shielding conductors ( &prime;). Another semifinished foil product (H H ) has shielding material ( ), which is joined by a dielectric ( ) to at least one layer of conductors ( &prime;), in which the shielding material ( ) is provided by photochemical structuring near the shielding conductors ( &prime;) with openings ( &prime;) extending to the dielectric ( ). The dielectric ( ) is removed in accordance with the openings ( ) extending to the shielding conductors ( &prime;) and by means of the openings ( &prime;) the shielding material ( ) is electrically contacted with the shielding conductors ( &prime;) so that signal conductors ( &prime;) are insulated by dielectric ( ) and shielded by shielding conductors ( &prime;) which are electrically connected to the shielding material ( ).

Process for producing connecting conductors

A method for producing a foil circuit board including a plurality of flexible electrically non-conductive and flexible conductive layers, which are laminated together. The non-conductive layers are positioned between the conductive layers and two of the conductive layers are the outermost surface layers of the foil circuit board. The circuit board includes flexible areas and rigid areas, and the flexible areas are provided by etching the board to remove at least part of one of the outermost surface layers and an adjacent underlying non-conductive layer.

Method for producing foil circuit boards

A method for the manufacture of printed circuit boards, foil circuit boards and semifinished products for printed and foil circuit boards formed from preliminary products with electrically conductive coatings (,) structurable to conductor patterns and structurable substrates (,), for the formation of connectors (V), contours (K) and conductor patterns (L), the connectors (V), contours (K) and conductor patterns (L) being structured simultaneously or in the same method steps from the preliminary products, and the connectors (V) and contours (K) are part of the structured preliminary product substrate, the connectors (V) being brought for electrical or mechanical connection into a position in which they are connectable and the finished conductor patterns (L) can be separated at contours (K).

Foil circuit boards and semifinished products and method for the manufacture thereof

Insulating foil circuit board with rigid and flexible sections

A multilayer laminated body has a determinate system of hollow passages and is formed by an assembly of flat layers of polymeric materials having major dimensions in orthogonal X and Y directions and a thickness dimension in a Z direction perpendicular to the X and Y directions. Selected ones of the layers have openings extending through in the Z direction, and other layers have canals formed in an X-Y plane. The openings and canals form parts of hollow passages so that assembly of multiple layers joins openings and canals forms complete and continuous passages through the assembled layers. Layers joined in pre-laminate assemblies are assembled together in precise relative positions for desired alignment of the canals and openings. The passages can be filled with optically conductive material or electrically conductive material and electrodes can be appropriately positioned for acting on fluids passing through the body.

Thin laminated microstructure with precisely aligned openings

Structuring of printed circuit boards

A process for the production of printed circuit boards and film circuit boards includes providing a starting product with a layer of insulating material between layers of metal. Openings are formed at desired locations through the metal and, at selected ones of those openings, openings are formed through the insulating material by plasma etching or chemical etching. The result of this is back-etching leaving projecting webs of metal extending partly across the openings. The projecting edges are removed by subjecting all of the metal surfaces to etching or electrodeplating which also thins the metal layers. The resulting structure is then plated, adding reinforcing thickness to the thinned metal layers and coating the openings through the insulating material with metal, providing interracial connections between the metal layers. The resulting intermediate can then be formed into a circuit board by forming circuit patterns in the metal layers.

Process for the production of structures

Process for the production of printed circuit boards with extremely

The surface of a metal foil to be used as an intermediate layer in printed circuit boards is chemically roughened. In one embodiment, fine depressions are etched out of the metal coating. In another embodiment, protuberances are plated thereon. The use of the method permits the use of the foil in the production of multilayer printed circuit boards with coatings having different thermal expansion characteristics and improves the adhesion with the next conductor layer applied thereto to a significant extent and prevents delamination.

Method of making a laminated structure with shear force delamination

A method for producing aligned passages through substrate materials, in which the projection of the inlet and outlet openings does not coincide, uses displaced application of etching windows on opposite sides and corresponding pronounced under-etching of these windows. By applying displaced etching windows on both sides of the substrate and through-etching the substrate through these windows, `oblique` passages are obtained through the substrate. By a suitable location of the windows it is also possible to produce branched passages with more than one outlet opening.

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Neftenbach, Switzerland

Marco Martinelli