Navitas Semiconductor Limited

International Rectifier Corporation

Infineon Technologies Americas Corp.

Marco Giandalia

Daniel Marvin Kinzer

Thomas J Ribarich

Santosh Sharma

Massimo Grasso

Victor Sinow

Tao Liu

Marco Passoni

Jason Zhang

Sergio Morini

Hongwei Jia

Ju Jason Zhang

Toshio Takahashi

Christian Locatelli

Alberto Guerra

Giovanni Galli

Andrea Merello

Jung Hee Lee

David Respigo

Stefano Ruzza

Monolithic high side GaN-based circuits using capacitors for level shifting. In one aspect, a power converter includes a GaN-based die, a switch formed on the GaN-based die and having a gate terminal, where the switch is arranged to be selectively conductive according to a driver signal applied to the gate terminal, a buffer circuit formed on the GaN-based die and arranged to receive an input signal and generate a corresponding differential output signal at a first output terminal and at a second output terminal, and a voltage level converter formed on the GaN-based die and having a first input terminal coupled to the first output terminal via a first capacitor and having a second input terminal coupled to the second output terminal via a second capacitor, where the first and second capacitors are formed on the GaN-based die, and the voltage level converter is arranged to generate the driver signal.

Monolithic high side gallium nitride device with integrated capacitive level shifter circuits

A circuit is disclosed. The circuit includes a first transistor including a first drain terminal, a first gate terminal and a first source terminal, a depletion-mode transistor including a second drain terminal, a second gate terminal and a second source terminal, the second drain terminal connected to the first drain terminal, the depletion-mode transistor arranged to sense a first voltage at the first drain terminal and generate a second voltage at the second source terminal, and a comparator arranged to receive the second voltage, and transition the first transistor from an on state to an off state in response to the first transistor entering its saturation region of operation. In one aspect, the first transistor includes gallium nitride (GaN). In another aspect, the circuit further includes a logic circuit arranged to receive an output voltage generated by the comparator and to drive the first gate terminal.

Integrated gallium nitride power device with protection circuits

An electronic circuit is disclosed. The electronic circuit includes a transistor having a gate terminal, a source terminal and a drain terminal, and a gate driver circuit including a pull-down transistor coupled to the gate terminal, and an input terminal arranged to receive an input signal and generate a corresponding output signal at an output terminal coupled to the gate terminal, where the gate driver circuit is arranged to store energy harvested from the input signal and use the stored energy to change a conductive state of the pull-down transistor. In one aspect, the transistor includes gallium nitride (GaN). In another aspect, the pull-down transistor includes GaN.

Integrated power device with energy harvesting gate driver

A circuit is disclosed. The circuit includes a current detecting FET, configured to generate a current signal indicative of the value of the current flowing therethrough, an operational transconductance amplifier (OTA) configured to output a current in response to the voltage of the current signal, and a resistor configured to receive the current and to generate a voltage in response to the received current, where the generated voltage is indicative of the value of the current flowing through the current detecting FET. The current detecting FET is configured to become nonconductive in response to the generated voltage indicating that the current flowing through the current detecting FET is greater than a threshold.

Overcurrent protection based on zero current detection

A current detecting GaN FET is disclosed. The current detecting GaN FET includes a first GaN switch having a first gate, a first drain, a first source, and a first field plate. The current detecting GaN FET also includes a second GaN switch having a second gate, a second drain, a second source, and a second field plate. The current detecting GaN FET also includes a resistor. The first and second gates are electrically connected, the first and second drains are electrically connected, and the resistor is connected between the first and second sources.

Current detection FET and resonant converter using the FET

A half bridge GaN circuit is disclosed. The half bridge GaN circuit includes a first power node having a first power voltage, where the first power voltage is referenced to a switch voltage at the switch node. The half bridge GaN circuit also includes a VMID power node having a VMID power voltage, where the VMID power voltage is referenced to the first power voltage and is less than the first power voltage by a DC voltage. The half bridge GaN circuit also includes a logic circuit, where a negative power terminal of the logic circuit is connected to the VMID node, and where a positive power terminal of the first logic circuit is connected to the first power node, where the logic circuit is configured to generate a logic output voltage, which controls the conductivity of the high side power switch.

Level shifting in a GaN half bridge circuit

A GaN resonant circuit is disclosed. The GaN resonant circuit includes a power switch configured to be selectively conductive according to one or more gate signals, and configured to generate a switch signal indicative of the value of the current flowing therethrough. The GaN resonant circuit also includes a power switch driver, configured to generate the gate signals in response to one or more control signals, where the power switch driver is configured to cause the power switch to become nonconductive in response to the switch signal indicating that the value of the current flowing through the power switch has transitioned across a threshold value.

Resonant converter control based on zero current detection

A half bridge GaN circuit is disclosed. The circuit includes a low side power switch configured to be selectively conductive according to one or more input signals, a high side power switch configured to be selectively conductive according to the one or more input signals, and a high side power switch controller, configured to control the conductivity of the high sigh power switch based on the one or more input signals. The high side power switch controller includes a capacitor, and a logic circuit, wherein the capacitor is configured to capacitively couple a signal based on the input signals to the logic circuit, and the logic circuit is configured to control the conductivity of the high sigh power switch based on the capacitively coupled signal.

Capacitively coupled level shifter

A power circuit is disclosed. The power circuit includes a power capacitor and a power resistor connected to the power capacitor. The power circuit also includes a power integrated circuit, including a GaN-based substrate, a power FET on the substrate, and a driver on the substrate. The driver is configured to charge a gate of the power FET using current from a power node. The power integrated circuit also includes a first power voltage regulator on the substrate, where the driver is configured to receive current from the capacitor through the resistor while the driver charges the gate of the power FET, and where the first power voltage regulator is configured to provide current to the capacitor while the driver does not charge the gate of the power FET.

GaN FET with integrated driver and slew rate control

A half bridge GaN circuit is disclosed. The circuit includes a low side circuit, which has a low side switch, a low side switch driver configured to drive the low side switch, a first level shift circuit configured to receive a first level shift signal, and a second level shift circuit configured to generate a second level shift signal. The half bridge GaN circuit also includes a high side circuit, which has a high side switch configured to be selectively conductive according to a voltage level of a received high side switch signal, and a high side switch driver configured to generate the high side switch signal in response to the level shift signals. A transition in the voltage of the high side switch signal causes the high side switch driver to prevent additional transitions of the voltage level of the high side switch signal for a period of time.

Half bridge driver circuits

According to an exemplary implementation, an integrated circuit (IC) includes a logic circuit monolithically formed on the IC. The logic circuit is configured to generate modulation signals for controlling power switches of a power inverter. The logic circuit generates the modulation signals based on at least one input value. The IC further includes a voltage level shifter monolithically formed on the IC. The voltage level shifter is configured to shift the modulation signals to a voltage level suitable for driving the power switches of the power inverter. The logic circuit can be a digital logic circuit and the input value can be a digital input value. The IC can also include a sense circuit monolithically formed on the IC. The sense circuit is configured to generate the input value.

System on chip with power switches

In one implementation, a power converter includes an output stage integrated circuit (IC) in a group III-V die including a depletion mode group III-V transistor, and a driver IC in a group IV die. The driver IC is configured to drive the output stage IC. In addition, a group IV control switch in the group IV die is cascoded with the depletion mode group III-V transistor. The power converter further includes an overcurrent protection circuit for the depletion mode group III-V transistor, the overcurrent protection circuit monolithically integrated in the group IV die.

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Marina Del Rey, CA, United States of America

Marco Giandalia