Hewlett Packard Enterprise Development LP

Hewlett-packard Development Company, L.p.

Leia Inc.

Marco Fiorentino

Raymond G Beausoleil

David A Fattal

Charles Santori

Zhen Peng

Cheng Li

Mir Ashkan Seyedi

Di Liang

Geza Kurczveil

Michael Renne Ty Tan

Jingjing Li

Sean Spillane

Wayne V Sorin

Paul Kessler Rosenberg

Sagi Varghese Mathai

Theodore I Kamins

Terrel L Morris

Zhihong Huang

Qianfan Xu

Nathan Lorenzo Binkert

Nathaniel Quitoriano

Jason Pelc

Kevin B Leigh

Norman Paul Jouppi

James A Brug

Ashkan Seyedi

Richard Stanley Williams

John Paul Strachan

Wei E Wu

Moray McLaren

Chin-Hui Chen

Wei Guang Wu

Robert S Schreiber

Duncan R Stewart

Tsung-Ching Huang

Nan Qi

Kunzhi Yu

Shih-Yuan Wang

William John Munro

Robert G Walmsley

Alan Lynn Davis

Hans S Cho

Amit S Sharma

Kai-Mei Camilla Fu

Andrei Faraon

Tsung Ching Huang

Luca Ramini

Jim Huang

Peter Jin Rhim

Michael W Cumbie

Jianhua Yang

Philip John Kuekes

Ian N Robinson

Naveen Muralimanohar

Kar-Han Tan

Keith Alexander Harrison

Huei Pei Kuo

Steven J Dean

Michael R T Tan

Timothy Paul Spiller

Sheng Li

Lars Helge Thylen

William M Tong

Stanley Cheung

Thomas Van Vaerenbergh

Robert Newton Bicknell

Yuan Yuan

Sai Rahul Chalamalasetti

Chih C Shih

Joaquin Matres

Sonny Vo

Yiwei Peng

Greg Astfalk

Sagi Mathal

Kehan Zhu

Jinsung Youn

Peng Sun

Rui Wu

Dana M Vantrease

Paul Edward Barclay

Raymond G Beausoliel

Raymond G Beausolall

Kyung Hoae Koo

Hyunmin Jeong

Janet Chen

Charles M Santori

Wayne Victor Sorin

Robert Samuel Schreiber

Norm P Jouppi

Michael RT Tan

Moray Mclaren

Example optical devices having a Mach-Zehnder interferometer (MZI) with improved linearity are presented. An example optical device may include an MZI and a microring resonator (MRR) optically coupled to any one of a first optical waveguide arm or a second optical waveguide arm, where the MRR is operable in a resonance state and in an off-resonance state during operation of the optical device. The MZI includes a length difference between the first optical waveguide arm and the second optical waveguide arm thereby achieving a quarter-period phase delay between optical signals of the first optical waveguide arm and the second optical waveguide arm such that a superlinear transmission region of the microring resonator is aligned with peaks of an optical output of the MZI improving linearity of the optical output of the MZI.

Optical device having a Mach-Zehnder interferometer with improved linearity

Examples described herein relate to a method for synchronizing a wavelength of light in an optical device. In some examples, a heater voltage may be predicted for a heater disposed adjacent to the optical device in a photonic chip. The predicted heater voltage may be applied to the heater to cause a change in the wavelength of the light inside the optical device. In response to applying the heater voltage, an optical power inside the optical device may be measured. Further, a check may be performed to determine whether the measured optical power is a peak optical power. If it is determined that measured optical power is the peak optical power, the application of the predicted heater voltage to the heater may be continued.

Proactive wavelength synchronization

Techniques and systems for a semiconductor laser, namely a grating-coupled surface-emitting (GCSE) comb laser, having thermal management for facilitating dissipation of heat, integrated thereon. The thermal management is structured in manner that prevents deformation or damage to the GCSE laser chips included in the semiconductor laser implementation. The disclosed thermal management elements integrated in the laser can include: heat sinks; support bars; solder joints; thermal interface material (TIM); silicon vias (TSV); and terminal conductive sheets. Support bars, for example, having the GCSE laser chip positioned between the bars and having a height that is higher than a thickness of the GCSE laser chip. Accordingly, the heat sink can be placed on top of the support bars such that heat is dissipated from the GCSE laser chip, and the heat sink is separated from directed contact with the GCSE laser chip due to the height of the support bars.

Thermal management for hybrid lasers

Embodiments of the present disclosure provide etch-variation tolerant optical coupling components and processes for making the same. An etch-variation tolerant geometry is determined for at least one waveguide of an optical coupling component (e.g., a directional coupler). The geometry is optimized such that each fabricated instance of an optical component design with the etch-variation tolerant geometry has substantially the same coupling ratio at any etch depth between a shallow etch depth and a deep etch depth.

Etch variation tolerant directional couplers

An photonic circuit includes a substrate, a plurality of first light waveguides disposed on the substrate, the first light waveguides extending in a first direction, a plurality of second light waveguides disposed on the substrate and extending in a second direction intersecting the first direction, and a plurality of first micro-ring resonators disposed on the substrate. Each of the first light waveguides has an intersection with each of the second light waveguides. Each of the intersections is provided with a first micro-ring resonator of the first micro-ring resonators. Each first micro-ring resonator is configured to route signals of a respective wavelength from one of the light waveguides at the intersection to another light waveguide at the intersection.

Dimensionally all-to-all connected network system using photonic crossbars and quad-node-loop routing

A photonic node includes a first circuit disposed on a first substrate and a second circuit disposed on a second substrate different from the first substrate. The first circuit is configured to route light signals originated from the photonic node to local nodes of a local group in which the photonic node is a member. The second circuit is configured to route light signals received from a node of an external group in which the photonic node is not a member, to one of the local nodes.

Multi-chip photonic node for scalable all-to-all connected fabrics

Examples herein relate to optoelectronic assemblies. In particular, implementations herein relate to an optoelectronic assembly formed via a chip on wafer on substrate (CoWoS) process. The optoelectronic assembly includes a substrate, an interposer, and an electronic integrated circuit (EIC). Each of the substrate, interposer, and EIC includes opposing first and second sides. The EIC is flip-chip assembled to the first side of the interposer, and the interposer with the EIC assembled thereto is flip-chip assembled to the first side of the substrate. An overmold layer extends over the first side of the interposer and encapsulates the EIC. The overmold layer includes a cavity such that a region of the first side of the interposer is exposed. An optical component is positioned within the cavity and coupled to the first side of the interposer.

Chip on wafer on substrate optoelectronic assembly and methods of assembly thereof

Techniques and circuitry for wavelength monitor and control are disclosed herein. The disclosed wavelength monitor and control circuitry and techniques are designed to realize a multi-channel DWDM optical link by using a photonic receiver that dynamically adjusts resonant wavelengths of the microring drop filter (MDF), as needed. The wavelength monitor and control circuitry can monitor and control the resonant wavelengths of multiple MDFs for a DWDM silicon photonics receiver with minimum power and area overhead. In an embodiment, circuitry for an optical receiver comprises an MDF having resonant wavelength for multiple DWDM channels, and circuitry to control and monitor the resonant wavelength of the MDF in real-time and in manner that compensates for deviation between actual resonant wavelength of the MDF and the incident optical wavelength of the MDF.

Wavelength control and monitor for dense wavelength division multiplexing (DWDM) silicon photonic receiver

An example system for multi-wavelength optical signal splitting is disclosed. The example disclosed herein comprises a first splitter, a second splitter, and a modulator. The system receives a multi-wavelength optical signal and an electrical signal, wherein the multi-wavelength optical signal comprises a plurality of optical wavelengths and has a power level. The first splitter is to split the plurality of optical wavelengths into a plurality of optical wavelength groups. The second splitter is to split the multi-wavelength optical signal or the plurality of optical wavelength groups into a plurality of lower power signal groups. The modulator is to encode the electrical signal into the plurality of optical wavelength groups, the plurality of lower power signal groups, or a combination thereof.

Multi-wavelength optical signal splitting

In example implementations, an optical connector is provided. The optical connector includes a jumper holder, a base bracket, and an optical ferrule. The jumper holder holds a plurality of ribbon fibers. The base bracket is coupled to an electrical substrate to mate with the jumper holder. The optical ferrule is coupled to an end of each one of the plurality of ribbon fibers. The optical ferrule is laterally inserted into a corresponding orthogonal socket that is coupled to a silicon interposer on the electrical substrate to optically mate the optical ferrule to the orthogonal socket.

Laterally mated optical connectors

Systems and methods are provided for processing an optical signal. An example system may include a source disposed on a substrate and capable of emitting the optical signal. A first waveguide is formed in the substrate to receive the optical signal. A first coupler is disposed on the substrate to receive a reflected portion of the optical signal. A second waveguide is formed in the substrate to receive the reflected portion from the first coupler. A second coupler is formed in the substrate to mix the optical signal and the reflected portion to form a mixed signal. Photodetectors are formed in the substrate to convert the mixed signal to an electrical signal. A processor is electrically coupled to the substrate and programmed to convert the electrical signal from a time domain to a frequency domain to determine a phase difference between the optical signal and the reflected portion.

Integrated silicon photonics and memristor dot product engine systems and methods

An example method of manufacturing a semiconductor device. A first wafer may be provided that includes a first layer that contains quantum dots. A second wafer may be provided that includes a buried dielectric layer and a second layer on the buried dielectric layer. An interface layer may be formed on at least one of the first layer and the second layer, where the interface layer may be an insulator, a transparent electrical conductor, or a polymer. The first wafer may be bonded to the second wafer by way of the interface layer.

Devices with quantum dots

Examples described herein relate to reducing a magnitude of a supply voltage for a circuit element of an optical transmitter device. In some such examples, the circuit element is a driving element that is to receive a first electrical data signal and to provide a second electrical data signal to an optical element that is to provide an optical data signal. A testing element is to compare the optical data signal to the first electrical data signal to determine whether the optical transmitter device meets a performance threshold. When the device meets the performance threshold, a regulating element is to reduce a magnitude of the supply voltage of the driving element.

Reducing supply voltages of optical transmitter devices

A photonic integrated circuit package includes two arrays or sets of integrated comb laser modules that are bonded to a silicon interposer. Each comb laser of an array has a common or overlapping spectral range, with each laser in the array being optically coupled to a local optical bus. The effective spectral range of the lasers in each array are different, or distinct, as to each array. An optical coupler is disposed within the silicon interposer and is optically coupled to each of the local optical buses. An ASIC (application specific integrated circuit) is bonded to the silicon interposer and provides control and operation of the comb laser modules.

Comb laser arrays for DWDM interconnects

One example includes an apparatus that includes a plurality of input/output (I/O) ports and a body portion. The plurality of I/O ports can be arranged at a plurality of peripheral surfaces of the body portion. The body portion includes a solid dielectric material having a substantially constant index of refraction. The body portion also includes parallel planar surfaces spaced apart by and bounded by the plurality of peripheral surfaces. The solid dielectric material in the body portion can be writable via a laser-writing process to form an optical waveguide extending between a set of the plurality of I/O ports.

Laser-written optical routing systems and method

Growing community of inventors

Mountain View, CA, United States of America

Marco Fiorentino