Texas Instruments Corporation

Marco Corsi

Robert Floyd Payne

Baher S Haroun

Neil Gibson

Kenneth George MacLean

Nirmal Chindhu Warke

Siraj Akhtar

Venkatesh Srinivasan

Tobin D Hagan

Louis N Hutter

Gabriel A Rincon

Barry Jon Male

Patrick Satarzadeh

David Louis Freeman

Nicolas Salamina

Stephen W Milam

Srinath Hosur

John P Erdeljac

Priscilla Enid Escobar-Bowser

Martin J Izzard

Edward C Suder

Juan Alejandro Herbsommer

Donald Charles Abbott

Taylor R Efland

Chih-Ming Hung

Roy Alan Hastings

Alfio Zanchi

Hassan Omar Ali

Chi-Cheong Shen

Roy Clifton Jones, Iii

Sriram Narayanan

William J Bright

Charles E Williams

Konrad Wagensohner

Quang X Mai

Wayne Tien-Feng Chen

Martin Kithinji Kinyua

Michael R Kay

Walter Bucksch

Tien-Ling Hsieh

Frank R Fattori

Nicholas Salamina

James Donald Quarfoot

Srinath Mathur Ramaswamy

Swaminathan Sankaran

Brian Paul Ginsburg

David John Baldwin

Leland Scott Swanson

Rajarshi Mukhopadhyay

Marwan M Hassoun

Arthur John Redfern

Imran Khan

Joseph Maurice Khayat

John William Fattaruso

Fernando Alberto Mujica

Richard K Hester

Gabriel Alfonso Ricon-Mora

Paul Merle Emerson

James R Hellums

Martijn Fridus Snoeij

Vijay B Rentala

Eunyoung Seok

Frank L Thiel

Scott Gary Sorenson

Derek Colman

Charles Sestok

Milton Lee Buschbom

Suribhotla Rajasekhar

William A Phillips

Kun Shi

Peter S Ying

Philip Sean Stetson

Victoria Wang

William David Smith

Dan Mavencamp

Michael David Score

Victoria W Limetkai

Gregory M Cooley

James Minh Tran

Robert B Borden

Russell Max Kinder

Kenneth L Arcudia

Victoria W Limketkai

Vaibhav Tripathi

William C Johnston

Raghunath Cherukuri

Jeffrey W Sanders

Ashwin Raghunathan

Seyed Miaad Seyed Aliroteh

Lemuel Herbert Thompson

Phillip Sean Stetson

Jim Quarfoot

In examples, an electronic device comprises a printed circuit board (PCB), an orifice extending through the PCB, and a semiconductor die suspended above the orifice by aluminum bond wires. The semiconductor die is vertically aligned with the orifice and the bond wires coupled to the PCB.

Suspended semiconductor dies

A sensor device includes a first and second Micro-Electro-Mechanical (MEM) structures. The first MEM structure includes a first heating element on a first layer of the first MEM structure. The first heating element includes an input adapted to receive an input signal. The first MEM structure also includes a first temperature sensing element on a second layer of the first MEM structure. The second MEM structure includes a second heating element on a first layer of the second MEM structure and a second temperature sensing element on a second layer of the second MEM structure. An output circuit has a first input coupled to the first temperature sensing element and a second input coupled to the second temperature sensing element.

Root mean square sensor device

A logarithmic amplifier circuit includes an adaptive gain amplifier circuit and a transistor. The adaptive gain amplifier circuit includes a gain stage and a diode. The gain stage includes an input terminal, and an output terminal. The diode includes a cathode terminal coupled to the output terminal, and an anode terminal coupled to a common terminal. The transistor includes a first terminal coupled to the input terminal, a second terminal coupled to the common terminal, and a third terminal coupled to the output terminal.

Logarithmic amplifier circuit

In the described examples, a driver includes a signal controller that provides a gate control signal to a gate buffer coupled to a gate of a transistor and a field plate control signal to a field plate buffer coupled to a field plate of the transistor. The signal controller provides a rising edge on the field plate control signal causing the field plate buffer to provide a bias voltage on the field plate of the transistor a predetermined amount of time after providing a rising edge on the gate control signal that causes the gate buffer to provide a turn-on voltage on the gate of the transistor that causes the transistor to transition from a cutoff region to a saturation region and to a linear region.

Driver for transistor

Embodiments of the invention provide a system and method for chip to chip communications in electronic circuits. In one embodiment, a networking device includes an input port circuit having a transmitter circuit coupled one or more transmitter antennas, wherein the input port circuit transmits a data packet to a first output port circuit using millimeter wave signals. The networking device includes output port circuits including at least the first output port circuit, each of the output port circuits having a receiver circuit coupled to one or more receiver antennas. The networking device includes a beamforming circuit coupled to the one or more transmitter antennas of the input port circuit, wherein the beamforming circuit causes the one or more transmitter antennas to transmit an antenna beam directed at the one or more receiver antennas of the first output port circuit.

Wireless chip-to-chip switching

A track and hold circuit includes a signal input terminal, a clock input terminal, an output terminal, a transistor, and a bootstrapping circuit with a transformer. The transistor includes a source, a drain, and a gate, where the source is coupled to the signal input terminal, and the drain is coupled to the output terminal. The transformer includes a primary winding coupled to the clock input terminal, and a secondary winding. The secondary winding is coupled between the source and the gate to control a gate-source voltage of the transistor.

Track and hold circuits with transformer coupled bootstrap switch

A pulse of terahertz radiation is transmitted through a touch panel formed of a dielectric material. The pulse generates an employable evanescent field in a region adjacent to a touch surface of the touch panel. The terahertz radiation has a frequency range between 0.1 terahertz and 10 terahertz. A reflected pulse is generated from an object located within the region adjacent to the touch surface of the touch panel. A position is triangulated of the object on the touch surface of the touch panel, based at least in part on the reflected pulse.

Touch screen

A sensor power management arrangement includes a signal processing circuit configured to receive signal from a sensor, to test the signal against at least one criterion, and to pass the signal for further processing in response to the signal passing the at least one criterion. In this way, only signals that are of a sufficient importance or significance will consume the maximum amount of processing energy and through processing by later processes or circuitry. Should a signal from a sensor not be strong enough or meet other criteria, power will not be wasted in preparing that signal for provision to the microcontroller or microprocessor. Additional flexibility in the sensor power management can be realized by adjusting the criteria against which the sensor signal is compared based on a status of the sensor apparatus.

Sensor power management

An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.

Dielectric waveguide core between ground planes secured in a channel

Embodiments of the invention provide a system and method for chip to chip communications in electronic circuits. A router or switch receives data packets at input port ASICs. A routing table on the input port ASIC or on a routing ASIC is used to identify a destination port ASIC based upon header information in the data packet. The data packet is transmitted from the input port ASIC to the destination port ASIC using millimeter wave signals that are transmitted across a waveguide or a wireless interface.

In some developing interconnect technologies, such as chip-to-chip optical interconnect or metal waveguide interconnects, misalignment can be a serious issue. Here, however, a interconnect that uses an on-chip directional antenna (which operates in the sub-millimeter range) to form a radio frequency (RF) interconnect through a dielectric waveguide is provided. This system allows for misalignment while providing the increased communication bandwidth.

Chip to dielectric waveguide interface for sub-millimeter wave communications link

Microstrip line of different widths, ground planes of different distances

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Parker, TX, United States of America

Marco Corsi