Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno

Koninklijke Philips Corporation N.v.

Marco Barink

Edsger Constant Pieter Smits

Jeroen Van Den Brand

Elise Claude Valentine Talgorn

Gerardus Titus Van Heck

Ozgur Tasar

Timon Rutger Grob

Walter Julius Weichsler

Jan-Eric Jack Martijn Rubingh

Rene Leonardus Jacobus Marie Ubachs

Guido Antonius Theodorus Adriaensen

Jasper C Volmer

Regan Starkey Foster

Kayleigh Williams

Lieven Adriaenssen

Sungsoo Lee

David Robert Storch

Dave Ahlman

Wolter F Benning

Ethan Albright

An electronic device () comprises a stretchable substrate () with a flap () formed by a cut () in the substrate (). The flap () is disconnected by the cut () from a surrounding main section () of the substrate () except on one side. The flap () is exclusively connected to the main section () via a connected section () of the substrate () between two ends () of the cut (). An electronic component () is disposed on the flap () with electrical contacts () connected to conductive tracks () disposed on the substrate (). The conductive tracks () extend between the component () disposed on the flap (), and other parts () of the electronic device () outside the flap () via the connected section (). The flap () with the component () is disposed in a pocket formed by surrounding lamination layers ().

Stretchable electronic device

A method of manufacturing a curved electronic device () and resulting product. A patterned layer of non-conductive support material () is printed onto a thermoplastic substrate () to form a support pattern. An electrical circuit () is applied onto the support pattern (), wherein the electrical circuit () comprises circuit lines () comprising a conductive material () applied onto support lines () of the pattern and electrical components () applied onto support islands () of the pattern. A thermoforming process (P) is used for deforming (S) the substrate () while a relatively high resistance of the support material () to the deforming maintains a structural integrity of the electrical circuit ().

Thermoforming an electronic device with surface curvature

Growing community of inventors

Eindhoven, Netherlands

Marco Barink