Intel Corporation

Marco Aurelio Cartas Ayala

Feras Eid

Weihua Tang

Peng T Li

Joe F Walczyk

John J Beatty

Hemanth K Dhavaleswarapu

Akhilesh P Rallabandi

Dinesh Padmanabhan Ramalekshmi Thanu

Luke J Garner

Venkata Suresh Guthikonda

Yonghao An

An integrated circuit (IC) die structure comprises a substrate material comprising silicon. Integrated circuitry is over a first side of the substrate material. A composite layer is in direct contact with a second side of the substrate material. The second side is opposite the first side. The composite layer comprises a first constituent material associated with a first linear coefficient of thermal expansion (CTE), and a first thermal conductivity exceeding that of the substrate. The composite layer also comprises a second constituent material associated with a second CTE that is lower than the first, and a second thermal conductivity exceeding that of the substrate.

Hybrid backside thermal structures for enhanced ic packages

Hybrid backside thermal structures for enhanced IC packages

Semiconductor packages having a sealant bridge between an integrated heat spreader and a package substrate are described. In an embodiment, a semiconductor package includes a sealant bridge anchoring the integrated heat spreader to the package substrate at locations within an overhang gap laterally between a semiconductor die and a sidewall of the integrated heat spreader. The sealant bridge extends between a top wall of the integrated heat spreader and a die side component, such as a functional electronic component or a non-functional component, or a satellite chip on the package substrate. The sealant bridge modulates warpage or stress in thermal interface material joints to reduce thermal degradation of the semiconductor package.

Semiconductor package having sealant bridge

Growing community of inventors

Chandler, AZ, United States of America

Marco Aurelio Cartas Ayala