Stmicroelectronics S.r.l.

Marco Alfio Torrisi

Michele Calabretta

Sebastiano Messina

Crocifisso Marco Antonio Renna

Sebastiano Russo

Francesco Rundo

Riccardo Emanuele Sarpietro

In an embodiment, a method includes: capturing a first image of a power module, the power module including a power electronics circuit, the power electronics circuit including power semiconductor dies; identifying positions of the power semiconductor dies in the first image with a die detection model; extracting second images of the power semiconductor dies from the first image according to the positions of the power semiconductor dies in the first image; and identifying defects of the power semiconductor dies in the second images with a defect detection model, the defect detection model being different from the die detection model.

System and method for power module defect detection

A converter circuit converts an input signal applied across a first and a second input node into a converted output signal across a first and a second output node. The converter circuit includes a switching network coupled to the first input node via an inductor having a current flowing therethrough. In a hysteresis current control mode of the switching network, the current flowing through the inductor has a triangular waveform with rising and falling edges between a first current threshold and a second current threshold alternating with a switching frequency. The switching frequency is controlled by varying the distance between the first current threshold and the second current threshold.

Control method for power supply converters, corresponding converter and device

Uncompensated upper and lower reference-currents are generated for first and second branches of a high-frequency half-bridge within an interleaved-totem-pole PFC. A first control-signal for the first branch is generated from comparison between an inductor-current and uncompensated reference-currents for the first branch, a first timing-reference is generated from the first control-signal from a number of active branches, a compensated upper reference-current is generated for the second branch by adding a first compensation-current to the uncompensated upper reference-current for the second branch, a compensated lower reference-current is generated for the second branch by subtracting the first compensation-current from the uncompensated lower reference-current for the second branch, a second control-signal is generated for the second branch from the compensated reference-currents for the second branch, a first timing-difference is generated from a phase-difference between the first and second control-signals, and the first compensation-current is generated from a difference between the first timing-reference and timing-difference.

Control method and circuit for phase shift regulation of interleaved converters at variable switching frequency

A method for soldering a die obtained using the semiconductor technique with a leadframe, comprising the steps of providing a leadframe, which has at least one surface made at least partially of copper; providing a die, which has at least one surface coated with a metal layer; applying to the surface a solder alloy comprising at least 40 wt % of tin or at least 50% of indium or at least 50% of gallium, without lead, and heating the alloy to a temperature of at least 380&#xb0; C. to form a drop of solder alloy; providing a die, which has at least one surface coated with a metal layer; and setting the metal layer in contact with the drop of solder alloy to form the soldered connection with the leadframe. Moreover, a device obtained with said method is provided.

Method for the manufacture of integrated devices including a die fixed to a leadframe

A variable duty cycle switching signal at a switching frequency is applied to a switching current regulation circuit arrangement energizing a current storage circuit assembly. Switching of the variable duty cycle switching signal is controlled by an upper and a lower threshold current level. The upper and lower threshold current levels vary with time following an average current value time variation. Additionally, frequency jitter is introduced in the variable duty cycle switching signal by: defining at least a frequency modulation window around a limit frequency identifying a limit value for an acceptable EMI; and applying an amplitude modulation of the upper and/or lower threshold current levels varying with time, wherein the amplitude modulation is applied in a time interval between times when the switching frequency enters and exit the frequency window.

Method to control a variable frequency switching converter, and corresponding variable frequency converter apparatus

A specimen holder is configured to hold, during a sample preparation procedure carried out using first and second sample preparation apparatuses, a semiconductor device to be analyzed using an electron microscope. The specimen holder includes a holding portion having a support configured to support the semiconductor device; and a supporting portion configured to releasable support the holding portion. The supporting portion includes an engaging element configured to couple the specimen holder into the first and second sample preparation apparatuses during the sample preparation procedure, and a guide configured to enable the holding portion to slide within the guide and vary a position of the holding portion with respect to the supporting portion.

Specimen holder for holding a semiconductor device during a sample preparation procedure carried out using first and second sample preparation apparatuses

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Aci Sant'Antonio, Italy

Marco Alfio Torrisi