Aptiv Technologies Limited

Marcin Hyrlicki

Grzegorz Szostek

Krzysztof Adamczyk

Pawel Brache

A heat dissipation device comprises a generally rectangular metal cooling plate; the metal plate comprises, on its upper face, first attachment means for attaching a first printed circuit board, which means are provided for bringing at least one heat-generating zone of the first printed circuit board to bear with the upper face of the plate; the metal plate comprises, on its lower face, second attachment means for attaching a second printed circuit board, which means are provided for bringing at least one heat-generating zone of the second printed circuit board to bear with the lower face of the plate.

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Liszki, Poland

Marcin Hyrlicki