Infineon Technologies Austria Ag

Marcel Rene Mueller

Oliver Blank

David Laforet

Cedric Ouvrard

Christof Altstaetter

A power semiconductor die has a semiconductor body coupled to first and second load terminals, and at least one power cell. In a horizontal cross-section of the at least one power cell, a contact has a contact region which horizontally overlaps with a field plate electrode and horizontally protrudes from the field plate trench, and a recess region does not horizontally overlap with the contact region and extends into a horizontal circumference of the field plate trench.

Needle cell trench MOSFET

A power semiconductor die has a semiconductor body coupled to a first load terminal and a second load terminal of the power semiconductor die and configured to conduct a load current between the load terminals. The die further comprises: a control trench structure for controlling the load current, the control trench structure extending into the semiconductor body along a vertical direction and arranged in accordance with a horizontal grid pattern having a plurality of grid openings; a plurality of power cells, each power cell being, in a horizontal cross-section, at least partially arranged in a respective one of the plurality of grid openings. At least one of the power cells comprises: a section of a drift zone of a first conductivity type, a section of a channel zone of a second conductivity type and a section of a source zone of the first conductivity type, wherein the channel zone section is electrically connected to the first load terminal and isolates the source zone section from the drift zone section; a control section with at least one control electrode section in the control trench structure; a columnar field plate trench extending into the semiconductor body along the vertical direction and including a field plate electrode electrically coupled to the first load terminal, the columnar field plate trench having a deep portion below the channel zone section and a proximal portion above the deep portion, the proximal portion vertically overlapping with the channel zone section, wherein a deep horizontal width of the deep portion amounts to at least 110% of a proximal horizontal width of the proximal portion.

Growing community of inventors

Bendorf, Germany

Marcel Rene Mueller