Siemens Aktiengesellschaft

Interuniversitair Micro-electronica Centrum, Vzw

Siemens N.v.

Other

Siemens Production & Logistics Systems Ag

Siemens S.a.

Siemens N.v. and Interuniversitair Micro-electronica Centrum Vzw

Marcel Heerman

Hubert De Steur

Eric Beyne

Jean Joseph Roggen

Eddy Roelants

Jozef Van Puymbroeck

Joost Wille

Rita Van Hoof

Ann Dumoulin

Jozef Puymbroeck Van

S&eacute;bastian Edm&eacute;

Rita Hoof Van

For the laser drilling of organic materials, in particular for making blind holes in dielectric layers, a frequency-doubled Nd-vanadate laser with the following parameters is used: 

Method and device for laser drilling organic materials

A method and device can be used to pattern both regions of a printed circuit board which are provided for coarse conductor structures and regions which are provided for relatively fine conductor structures of the printed circuit board. In each case, this can be done via laser processing. Both regions are firstly coated with a continuous metallization layer and covered with an etch resistor. The coarse conductor structures are predefined with a laser beam with a relatively long wavelength by exposing the metal surfaces which are not required. In addition, the fine conductor structures are also pre-shaped by processing the etch resist with a laser beam with a relatively short wavelength. Then, in a common etching process, all the exposed surface regions of the metal layer are etched away so that only the coarse and fine conductor track structures which are covered by the remaining etch resist are left. As a result of the removal of the rest of the etch resist, the surfaces of the conductor tracks which are produced are then exposed.

Method and apparatus for structuring printed circuit boards

An intermediate base supports a semiconductor module on a printed circuit board. The intermediate base has an upper face on which the semiconductor component is directly mounted with its component connecting elements facing the upper face. The base has through-holes which are incorporated from a lower face of the base body so that the component conducting elements of the semiconductor component are exposed. The through-holes are then at least partially coated with a metal layer, which also contacts the exposed portions of the component connecting elements. Each of the through-holes has at least a partially annular notch, so that each through-hole extends through a recessed stud, which is used to form an external connection for the module onto the printed circuit board.

Intermediate base for a semiconductor module and a semiconductor module using the intermediate base

A method and device for the laser drilling of laminates includes the use of a frequency-doubled Nd vanadate laser. The laser includes the following parameters: pulse width<40 ns, pulse frequency&gE;30 kHz for the metal layer and &gE;20 kHz for the dielectric layer, and wavelength&equals;532 nmn. Such a laser is used for the laser drilling of laminates which have at least one metal layer and at least one dielectric layer including an organic material.

Method and device for laser drilling laminates

A method for introducing plated-through holes into an electrically insulating base material includes steps of: providing an electrically insulating base material having a first surface with a first metal layer and a second surface with a second metal layer; applying an etching resist layer at least to the first metal layer; using electromagnetic radiation to remove the etching resist layer and to thereby uncover the first metal layer in regions where plated-through holes are to be produced; etching away the uncovered regions of the first metal layer as far as the first surface of the base material; and using a laser beam to produce the plated-through holes in the base material.

Method for introducing plated-through holes into an electrically insulating base material having a metal layer on each side

The invention relates to a method for describing a predetermined desired course ( ) with a beam of particles or waves, wherein a movable beam-directing device influences the direction of the beam, so that the latter describes an actual course ( ). The deviation of the actual course ( ) from the desired course due to inertia is minimized by specifying a corrected desired course ( ), which describes diversions at the point of direction changes. The invention also relates to the use of this method for laser structuring or for writing guard plates or dial plates.

Method for describing a predetermined desired course with a beam consisting of particles or waves and use of this method

To drill micro-holes in a multi-layer substrate having a first metal layer and at least one second metal layer, and having a dielectric layer arranged between two metal layers, use is made of a solid-state laser. The beam of the laser, in a first operation, ablates the first metal layer and, in a second operation, ablates the dielectric layer down to the second metal layer. In the first operation, the laser beam is set to a repetition frequency of at least 15 kHz, focused onto the first metal layer and moved in a circle corresponding to the diameter of the desired hole, in such a number of passes until this metal layer is cut through. Then, in the second operation, the laser beam is set to a preferably lower repetition frequency, directed out of focus onto the dielectric layer exposed in the hole and moved, with a circumferential velocity which is higher compared with the first operation, in one or more concentric circles, until the dielectric layer is ablated in the hole region. The effective energy density in the second operation is selected, by setting the defocusing and the circumferential velocity, in such a way that the effective energy density lies below the threshold for ablation of the second metal layer.

Method for drilling micro-holes with a laser beam

A metal layer, an etching resist and a photoresist are successively applied to an electrically insulating substrate. Whereupon the photoresist is patterned by photolithography in such a way that it covers a pattern of the later coarse conductor structures and the entire region of the later fine conductor structures. After the uncovered etching resist has been stripped, the photoresist is removed, whereupon the etching resist is patterned with the aid of a laser beam in such a way that it has the pattern of the fine conductor structures. The coarse conductor structures and the fine conductor structures are then formed in a common etching process.

Method for producing wiring configurations having coarse conductor structures and at least one region having fine conductor structures

For the laser machining of organic materials, a laser with the below listed parameters is used. The laser has a wavelength of 300 nm to 1200 nm, a pulse width of <50 ns and a pulse frequency of >20 kHz. To increase a degree of absorption and consequently the machining rate, additives with good absorption of the laser beam with the respectively chosen wavelength are admixed with the organic materials.

Method for the laser machining of organic materials

A structural shape has an injection molded, three-dimensional substrate composed of an electrically insulating polymer, polymer studs planarly arranged on the underside of the substrate and co-formed during injection molding, outside terminals formed on the polymer studs by a solderable end surface, interconnections fashioned at least on the underside of the substrate that connect the outside terminals to inside terminals, and at least one chip arranged on the substrate and whose terminals are electrically conductively connected to the inside terminals. The structural shape is suitable for single, few or multi chip module and unites the advantages of a ball grid array with the advantages of MID technology (Molded Interconnection Devices). The manufacture and metallization of the polymer studs can take place with minimal additional outlay in the framework of the method steps already required in the MID technology.

Polymer stud grid array

In order to form metallic conductor patterns having connection regions that can be soldered and/or bonded on electrically insulating substrates, firstly a metalization is applied to the substrate and is then removed again, at least in those regions adjoining the desired conductor pattern. There then follows the electrolytic deposition of a final surface which can be soldered and/or bonded to the connection regions. Clean-room conditions are not necessary.

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Merelbeke, Belgium

Marcel Heerman