Epcos Ag

Tdk Corporation

Commissariat À L'énergie Atomique Et Aux Énergies Alternatives

Rf360 Singapore Pte. Ltd.

Commissariat a L'energie Atomique Et Aux Energies Alternatives

Snaptrack Incorporated

Marcel Giesen

Gudrun Henn

Jean-Louis Pornin

Damien Saint-Patrice

Bruno Reig

Arnoldus Den Dekker

Florent Greco

Wolfgang Pahl

Pirmin Hermann Otto Rombach

Anton Leidl

Thomas Metzger

Jan Tue Ravnkilde

Kurt Rasmussen

Jürgen Portmann

Stefan Freisleben

Christoph Eggs

Marc Esquius Morote

Morten Ginnerup

Armin Schober

Matthias Jungkunz

Ansgar Schäufele

Stephan Pohlner

Ilya Lukashov

Thomas Telgmann

Phillip Ekkels

Alexandre Agusto Shirakawa

An RF filter device that provides small spatial dimensions and good electric performance is provided. The filter device comprises a resonator structure and a further electric circuit. An acoustic minor is arranged between the active structure and the further electric circuit.

RF filter device

Electroacoustic devices with a capacitive element and methods for fabricating such electroacoustic devices. An example method includes forming an acoustic device above a first region of a substrate, and forming a capacitive element above a second region of the substrate and adjacent to the acoustic device. The forming of the capacitive element may include forming a protective layer above the substrate where a first portion of the protective layer is above the second region of the substrate and a second portion of the protective layer is above the first region of the substrate, forming a dielectric region above the protective layer, and forming an electrode above the dielectric region. The dielectric region may include a different material than the protective layer.

Etch stop and protection layer for capacitor processing in electroacoustic devices

A packaging structure including at least one hermetically sealed cavity in which at least one microelectronic device is arranged, the cavity being formed between a substrate and at least one cap layer through which several release holes are formed. Several separated portions of metallic material are provided such that each of the separated portions of metallic material is arranged on the cap layer above and around one of the release holes and forms an individual and hermetical plug of said one of the release holes. At least one diffusion barrier layer including at least one non-metallic material is arranged on the cap layer and forms a diffusion barrier against an atmosphere outside the cavity at least around the release holes. Parts of the diffusion barrier layer are not covered by the portions of metallic material.

Packaging structure of a microelectronic device having a hermeticity improved by a diffusion barrier layer

A top-port MEMS-microphone has an upper side and a bottom side. The microphone includes a MEMS chip with a monolithically connected protection element at the upper side, a backplate, and a membrane. The microphone also includes a sound inlet at the upper side and a mechanical or electrical connection at the bottom side.

Top-port MEMS microphone and method of manufacturing the same

A component includes a carrier and a functional structure on the carrier. A thin-film cover covers the functional structure and is used as a mounting base for a circuit part, which is arranged over the thin-film cover. The circuit part is connected to the functional structure by means of a lead.

Miniaturized multi-part component and method for producing same

A method for packaging a microelectronic device in an hermetically sealed cavity and managing an atmosphere of the cavity with a dedicated hole, including making said cavity between a support and a cap layer such that a sacrificial material and the device are arranged in the cavity; removing the sacrificial material through at least one release hole, and hermetically sealing the release hole; making a portion of wettable material on the cap layer, around a blind hole or a part of said outside surface corresponding to a location of said dedicated hole; making a portion of fuse material on the portion of wettable material; making the dedicated hole by etching the cap layer; and reflowing the portion of fuse material with a controlled atmosphere, forming a bump of fuse material which hermetically plugs said dedicated hole.

Method for packaging a microelectronic device in a hermetically sealed cavity and managing the atmosphere of the cavity with a dedicated hole

A method can be used for producing a microelectromechanical transducer. A plurality of microelectromechanical transducers are produced on a single wafer. Each transducer includes a diaphragm. The wafer is divided into at least a first and a second region. The mechanical tensions of a random sample of diaphragms of the first region are established and the values are compared with a predetermined desired value. The mechanical tensions of a random sample of diaphragms of the second region are established and the values are compared with the predetermined desired value. The tensions of the diaphragms in the first region are adjusted to the predetermined desired value, and the tensions of the diaphragms in the second region are adjusted to the predetermined desired value.

Method for producing a microelectromechanical transducer

Method of hermetically sealing a hole with a fuse material, comprising the following steps: applying a portion of wettable material onto a surface such that it completely surrounds the hole made through said surface and is located outside the hole, or completely surrounds a first part of said surface corresponding to a location of the hole; applying a portion of fuse material on the portion of wettable material and on a second part of said surface located around the portion of wettable material; reflowing the portion of fuse material to form a bump of fuse material which has a shape corresponding to a part of a sphere, which is fastened only to the portion of wettable material and which hermetically plugs the hole; wherein the hole is made in said surface before reflowing the portion of fuse material.

Method of hermetically sealing a hole with a fuse material

Growing community of inventors

Munich, Germany

Marcel Giesen