Peraso Technologies Inc.

Marc Supinski

Mihai Tazlauanu

Mahmoud Niroo Jazi

A wireless communications module includes: a primary board including (i) a first surface bearing a radio controller, and defining a set of control contacts for connection to respective ports of the radio controller, and (ii) a second surface opposite the first surface; an antenna array integrated with the primary board, the antenna array including a plurality of unit cells each having: an inverted-L antenna having a planar element adjacent to the second surface of the primary board, and an orthogonal element extending from the planar element to a feed layer within the primary board; and a passive patch element between the planar element and the feed layer.

Millimeter-wave phased-arrays with integrated artificially pillowed inverted-L antennas

A wireless communication assembly includes a first support member carrying a baseband processor and a radio processor, and defining a first mounting surface including a first pair of electrical contacts. The first support member has a first pair of electrical connections between the radio processor and the first electrical contacts. The assembly also includes a second support member carrying an antenna and defining a second mounting surface including a second pair of electrical contacts. The second support member has a second pair of electrical connections between the antenna and the second electrical contacts. The second mounting surface is configured to engage the first mounting surface to rigidly couple the first and second support members and to bring the first pair of electrical contacts into contact with the second pair of electrical contacts for electrically connecting the radio processor and the antenna via the first and second pairs of electrical connections.

Growing community of inventors

Toronto, Canada

Marc Supinski