Seagate Technology Incorporated

Marc Ronshaugen

Joel William Hoehn

Gordon Merle Jones

Yuhong Xiong

Huaqing Yin

Edwin F Rejda

Robert E Chapin

Kevin Lamber Mayer

Paul E Gallup

One or more slider bars are attached to at least one component of a multi-component carrier device. The multi-component carrier device is attached to a lapping arm of a lapping machine and the one or more slider bars attached to the carrier device are lapped. The at least one component of the multi-component carrier device is attached to a grinding/cutting machine. At least one of a grinding operation or a cutting operation is performed on the one or more slider bars.

Method and assembly for grinding and/or cutting a slider bar on a lapping carrier

A slider bar extender to removably connect one or more slider bars to a processing machine or tool is disclosed. In illustrated embodiments, the extender is coupled to a holder structure through a tongue and groove connection. In illustrated embodiments, the tongue is formed on the holder structure and the groove is formed on the extender. In illustrated embodiments, the extender includes a plurality of reduced thickness strips. The reduced thickness strips are orientated lengthwise to control or transfer bending to one or more bars connected to a proximal edge surface of the extender.

Lapping assembly or process utilizing a bar stack extender

An assembly includes a carrier device having proximal and distal ends. The carrier device includes a workpiece platform along the proximal end. The workpiece platform supports one or more slider bars. The carrier device attaches to a lapping machine. An adaptive component, including at least one spring, has a first portion that couples to the carrier device and a second portion that couples to a grinding-slicing machine.

Universal carrier device and adaptive components for the carrier device

A head structure for a lapping assembly including a lapping control feature is disclosed. The lapping control feature includes a raised contact surface elevated from a front surface of the head structure of the lapping assembly. A relative position of the workpiece and raised contact surface are aligned to control workpiece thickness and other lapping parameters. In illustrated embodiments, the relative position of the workpiece and raised contact surface are aligned via an adjustment mechanism on the head structure. In illustrated embodiments, the adjustment mechanism is configured to adjust a position of the workpiece relative to the raised contact surface.

Lapping device with lapping control feature and method

Recording heads for data storage systems are provided. Recording heads illustratively include a write pole, a bumper, a dielectric layer, and a surface. In some embodiments, a portion of the surface includes portions of the write pole, bumper, and dielectric layer. The write pole, bumper, and dielectric layer are illustratively made from materials that have polishing rates. In some embodiments, the polishing rate for the write pole material is more similar to the polishing rate for the bumper material than it is to the polishing rate for the dielectric layer material.

Methods and devices to control write pole height in recording heads

A carrier for a slider row bar for a lapping process. The carrier has a mounting structure comprising a material configured to have a first modulus of at least 1,000,000 Pa at a first period of time and a second modulus of 500 Pa to 500,000 Pa at a second period of time subsequent to the first period. The change from the first modulus to the second modulus is due to an external stimulus on the material.

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Eden Prairie, MN, United States of America

Marc Ronshaugen