Bull Sas

Le Commissariat À L’énergie Atomique Et Aux Énergies Alternatives (cea)

Le Commissariat À L'énergie Atomique Et Aux Énergies Altervatives (cea)

Commissariat &#xc0; L'&#xc9;nergie Atomique Et Aux &#xc9;nergies Alternatives

Marc Raeth

Luc Dallaserra

An interlayer heat sink for a liquid cooling system for an electronic card, the interlayer heat sink including a cold inlet connector, a hot inlet connector, a hot outlet connector, and a cold outlet connector. An upper part of the cooling block divides the flow of heat transfer fluid entering through the cold inlet connector into a first flow, which is oriented towards the lower part of the cooling block so as to collect heat generated by the electronic card by being conveyed to the hot outlet connector, and a second flow, oriented directly to the cold outlet connector, to convey the flow of heated-up heat transfer fluid received on the hot inlet connector directly to the hot outlet connector where it fuses with the heated-up flow in the lower part of the cooling block.

Interlayer heat sink for cooling system of an electronic card of a supercomputer

An inlet heat sink for a liquid cooling system of an electronic board, including a cold inlet connector, a hot outlet connector, and a cold outlet connector. An upper part of a cooling block being configured to divide a flow of incoming heat transfer fluid by the cold inlet connector into a first flow oriented to collect the heat generated by the electronic board by being routed to the hot outlet connector, and a second flow, oriented directly to the cold outlet connector.

Inlet heat sink for a cooling system of a supercomputer electronic board

An outlet heat sink for a liquid cooling system for an electronic board, including a cold inlet connector, a hot inlet connector and a hot outlet connector. An upper part of a cooling block, on the one hand, conveys the flow of heat transfer fluid entering through the cold inlet connector to the lower part of the cooling block so as to collect heat generated by the electronic board by being conveyed to the hot outlet connector, and on the other hand, conveys the flow of heated-up heat transfer fluid received on the hot inlet connector directly to the hot outlet connector.

Outlet heat sink for cooling system of a supercomputer electronic board

A heatsink for a plurality of memory modules that can be connected to an electronic board, each memory module including two heat exchange surfaces, includes at least one envelope including a top surface, at least two outer tabs, configured to be in thermal contact with at least one heat exchange surface of at least one memory module, at least one contact surface, in thermal contact with the fluid cooling system of said electronic board, a plurality of inner tabs, each inner tab being interposed between two memory modules in order to make thermal contact with at least one exchange surface of each of the two memory modules, the envelope is detachably placed against the two exchange surfaces of each memory module, the envelope is mechanically detachably fastened to the board.

Heatsink for multiple memory modules

A liquid cooling system for a circuit board made up of a cold plate and heat sinks connected to the cold plate by flexible connections.

Growing community of inventors

Tacoignières, France

Marc Raeth