Marvell International Limited

Marvell Asia Pte., Ltd.

Marvellworld Trade Ltd.

Marc Jacobs

Long-Ching Wang

Lijuan Zhang

Scott Wu

David L Ganapol

Hsui-Ping Peng

Jigar Mulchandbhai Bhajiwala

Michael Gonia

Kai Chieh Chan

The present disclosure describes a coaxial-interconnect structure that is integrated into a semiconductor component and methods of forming the coaxial-interconnect structure. The coaxial interconnect-structure, which electrically couples circuitry of an integrated-circuit (IC) die to traces of a packaging substrate, comprises a signal core elongated about an axis, a ground shield elongated about the axis, and an insulator disposed between the signal core and the ground shield.

Coaxial-interconnect structure for a semiconductor component

A probe card for testing dies of a substrate during a wafer sort process includes a printed circuit board (PCB) and a test site arranged to connect respectively to one of the dies during a test cycle. The test site includes a first pin connecting band and a first pin set. The first pin connecting band is connected to the PCB. The first pin set is connected to the first pin connecting band and includes a pin configuration for a testing device to perform a first type of test on a first die. The test site includes only pins in the first pin set. A number of pins in the first pin set is less than a number of pins used to perform a second type of test on the first die. The second type of test is performed at a slower processing speed than the first type of test.

Multi-test type probe card and corresponding testing system for parallel testing of dies via multiple test sites

The present disclosure describes apparatuses and techniques for self-aligning integrated circuit (IC) dies. In some aspects, a hydrophobic material is deposited on a surface of a substrate to form a pattern on the surface of the substrate. The pattern may expose areas of the substrate surface for placement of IC dies. A water-based solution is then applied to the exposed areas such that droplets form on the exposed areas of the substrate surface. IC dies are placed on the droplets of the water-based solution, which can cause the IC dies to align with the exposed areas of the substrate surface. The droplets are then caused to evaporate such that the IC dies settle on the exposed areas of the substrate surface.

Methods and apparatus for self-alignment of integrated circuit dies

Embodiments of the present disclosure provide a method directed towards applying an average radio calibration result obtained from one or more units of a manufacturing order to another unit of the manufacturing order and performing a verification test on the other unit to determine whether the other unit is calibrated to a pre-determined specification. Other embodiments may be described and/or claimed.

Reducing calibration testing time

Embodiments of the present disclosure provide techniques and configurations to determine, by a digital image capture device, that lens calibration data is to be downloaded for a lens assembly of the digital image capture device and to download the lens calibration data. Other embodiments may be described and/or claimed.

Growing community of inventors

Redwood City, CA, United States of America

Marc Jacobs