Alcatel

Marc Huan

Olivier Vendier

Norbert Venet

St&eacute;phane Albinet

Sylvain Paineau

Jean-Cyril Esther

Philippe Calvel

An electronic assembly comprising an electronic module provided with optical interconnection and heat removal means, the heat removal means comprising a soleplate dedicated to removing heat on which the module is mounted. The interconnection means is independent of the soleplate and preferably comprises a printed circuit and an optical fiber included in the printed circuit. The optical fiber has an end put accurately in register with an optical contact of the module by a BGA type mounting of the printed circuit on the module. A BGA type mounting consists in placing with precision firstly balls on the module and secondly areas on the circuit, and then in bringing the balls and areas face to face so that the balls center themselves automatically with the areas by capillarity.

Electronic assembly having high interconnection density

A method of obtaining a module ( ), and the module obtained, from modular electronic components encapsulated in flat monoblock packages ( A) in which elements constituting the components are buried and from which project laterally conductive connecting leads ( A), the packages being stacked and buried in an insulative block corresponding to at least one module and the projecting connecting leads of the stacked packages being flush with a surface of the block, on at least one face of said block on which are formed conductive interconnection tracks and/or contacts for connecting the leads with connecting means external to the module. The method includes, before stacking the packages, an operation of modifying the connecting leads of the packages in order to reduce their overall size and an operation of reducing the height of the packages by thinning their respective bases.

Method of modifying connecting leads and thinning bases of encapsulated modular electronic components to obtain a high-density module, and a module obtained thereby

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Cox, France

Marc Huan