E.i. Dupont De Nemours and Company

Marc Henry Labranche

Kenneth Warren Hang

Yuko Ogata

Paul Douglas Vernooy

Alan Frederick Carroll

Keiichiro Hayakawa

Jerome David Smith

Barry Edward Taylor

Alfred T Walker

Constance Wenger, Legal Representative

This invention relates to a copper thick film paste composition paste comprising copper powder, a Pb-free, Bi-free and Cd-free borosilicate glass frit, ruthenium-based powder, and an organic vehicle. The invention also provides methods of using the copper thick film paste composition to make a copper conductor on a substrate. Typical substrates are selected from the group consisting of aluminum nitride, aluminum oxide and silicon nitride.

Copper paste composition and its use in a method for forming copper conductors on substrates

Thick film resistor paste compositions, and methods for making the thick film compositions are disclosed. The compositions include a resistor composition dispersed in an organic vehicle. The resistor composition has 3 to 60% by weight RuOconductive material, 5 to 75% by weight Ag conductive material, 15 to 60% by weight glass frit and optionally up to 10% by weight copper oxide or precursor thereof, and up to 20% by weight bismuth oxide or precursor thereof. Optionally the glass is (by weight) 25-45% SiO, 2-15% AlO, 0-3% ZrO, 0-8% BO, 5-15% CuO, 0-8% BaO, 0-3% PO, and 20-50% BiO. The resistor composition when printed to a dry thickness and fired at a temperature between 750&#xb0; C. and 950&#xb0; C. achieves a sheet resistivity between 10 and 10,000 milliohms/square and a hot temperature coefficient of resistivity of 1000 ppm/C or higher. The fired resistor composition may achieve a resistance thickness ratio (R) value between 0.75 and 1.50.

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This invention relates to a copper thick film paste composition paste comprising copper powder, a Pb-free, Bi-free and Cd-free borosilicate glass frit, a component selected from the group consisting of ruthenium-based powder, copper oxide powder and mixtures thereof and an organic vehicle. The invention also provides methods of using the copper thick film paste composition to make a copper conductor on a substrate. Typical substrates are selected from the group consisting of aluminum nitride, aluminum oxide and silicon nitride.

The invention relates to a surface-modified RuOconductive and a lead-free powdered glass material formulated to make a paste suitable for application to the manufacture of a thick film resistor material. The resistance range that is most suitable to this invention is a resistor having 10 kilo-ohms to 10 mega-ohms per square of sheet resistance. The resulting resistors have &#xb1;100 ppm/&#xb0; C. TCRs.

Surface-modified ruthenium oxide conductive material, lead-free glass(es), thick film resistor paste(s), and devices made therefrom

A substantially lead-free thick-film resistor paste composition is disclosed including a resistor composition dispersed in an organic vehicle. The resistor composition includes (a) RuOconductive material; (b) an &#x3b1;-oxide selected from CuO, NaO, KO, LiO and combinations thereof (c) a borosilicate glass composition having: (i) BO, (ii) SiO, (iii) a &#x3b4;-oxide selected from BaO, CaO, ZnO, SrO, MgO and combinations thereof, and optionally including any of (iv) PO, (v) ZrOand (vi) AlO. The CuO &#x3b1;-oxide and TiO, TaO, NbO&#x3b2;-oxide(s) and combinations thereof are present in the paste composition either separately, or in the borosilicate glass composition, or both. The NaO, KO, LiO &#x3b1;-oxide(s) and combinations thereof are present in the borosilicate glass composition. TCR values in the range of +/&#x2212;100 ppm/&#xb0; C. and R values of 100 ohms to 10 mega-ohms per square are obtained by resistors made from the paste composition.

Lead-free resistive composition

This invention relates to a composition using a ruthenium oxide and/or a polynary ruthenium oxide as conducting components and using a Cu containing glass frit.

Resistor compositions using a Cu-containing glass frit

A method for making multilayer electronic circuits comprising the sequential steps of

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Chapel Hill, NC, United States of America

Marc Henry Labranche