Antaios

Centre National De La Recherche Scientifique

Marc Drouard

Julien Louche

Witold Kula

Jean-Pierre Nozieres

Gilles Louis Gaudin

Jérémy Brun-Picard

Jérémie Vigier

Sylvain Martin

The present disclosure concerns a method for fabricating a magnetoresistive element comprising a magnetic tunnel junction including a tunnel barrier layer, a first ferromagnetic layer and a second ferromagnetic layer; a writing current layer; and an interconnect layer configured for supplying the writing current to the writing current layer. A gap is provided in the interconnect layer such that the latter comprises two discontinuous interconnect segments extending along a layer plane and connecting the writing current layer in series. The method comprises: depositing the interconnect layer, writing current layer, second ferromagnetic layer, tunnel barrier layer and first ferromagnetic layer; forming the gap in the interconnect layer; filling the gap with the gap material; and forming the pillar by performing a single etch step until the interconnect layer, acting as a stop layer, is reached.

Method for fabricating a magnetoresistive element comprising discontinuous interconnect segments

A SOT-MRAM cell, comprising at least one magnetic tunnel junction (MTJ) comprising a tunnel barrier layer between a pinned ferromagnetic layer and a free ferromagnetic layer; a SOT line, extending substantially parallel to the plane of the layers and contacting a first end of said at least one MTJ; at least a first source line connected to one end of the SOT line; at least a first bit line and a second bit line, wherein the SOT-MRAM cell comprises one MTJ, each bit line being connected to the other end of the MTJ; or wherein the SOT-MRAM cell comprises two MTJs, each MTJ being connected to one of the first bit line and second bit line.

SOT MRAM cell and array comprising a plurality of SOT MRAM cells

A magnetic memory (MRAM) cell, comprising: a first layer formed from a substantially electrically conductive material; and a magnetic tunnel junction (MTJ) stack formed over the first layer, wherein the MTJ stack comprises: a ferromagnetic reference layer having an in-plane reference magnetization; a tunnel barrier layer; and a ferromagnetic storage layer between the tunnel barrier layer and the first layer, the storage layer having an in-plane storage magnetization; wherein the MTJ stack comprises an arrangement for providing an in-plane uniaxial anisotropy in the storage layer; wherein said in-plane uniaxial anisotropy makes an angle with the direction of the write current that is between 5&#xb0; and 90&#xb0;, and wherein said in-plane uniaxial anisotropy has an energy between 40 and 200 kBT and wherein coercivity is larger than 200 Oe.

Magnetic memory cell having deterministic switching and high data retention

A memory device may comprise a substrate defining a main plane; a plurality of memory cells each comprising a SOT current layer disposed in the main plane of the substrate and a magnetic tunnel junction residing on the SOT current layer; and a bit line and a source line to flow a write current in a write path including the SOT current layer of a selected memory cell. The source line comprises a conductive magnetic material providing a magnetic bias field extending to the magnetic tunnel junction of the selected memory cell for assisting the switching of the cell state when the write current is flowing.

Growing community of inventors

Valence, France

Marc Drouard