Lumileds LLC

Marelli Automotive Lighting Reutlingen (germany) Gmbh

Marc Droegeler

Joseph Hendrik Anna Maria Jacobs

Wim Boogaard

Matthias Holtrup

Thorsten Erich Lenzen

Floris Maria Hermansz Crompvoets

Benno Spinger

Frank Giese

Andreas Stang

Thorsten Anger

Dirk Vanderhaeghen

Anna Harder

A cluster of lighting devices, a display and a method of manufacturing a display are described. The lighting device includes a mixing box, a light source, a transparent layer and a light diffusing layer. The light source is embedded in the mixing box. The transparent layer is adjacent to the light source. The light diffusing layer is adjacent to the transparent layer. A surface emitter display includes a cluster of surface emitters including a plurality of surface emitters. At least one circuit board is electrically coupled to at least one surface emitter of the plurality of surface emitters.

Cluster of lighting devices, display and method of manufacture

A light-emitting device (LED) module is described. The LED module includes a heatsink, at least one LED on a top surface of the heatsink, and mounting features protruding from the top surface of the heat sink for alignment with an optical component. A thermally insulating material is adjacent at least portions of the mounting features that would otherwise be in contact with the optical component when mounted.

LED module with thermal insulation towards optical component and vehicle headlight with such LED module

An LED module is described herein. The LED module includes a heatsink with an LED mounting area and a referencing part that is separate from the heatsink. The referencing part is fixed to the heatsink and includes an LED alignment feature and an optical component alignment feature. At least one LED is provided on the LED mounting area of the heatsink and aligned with the LED alignment feature of the referencing part.

LED module with separate heat sink and referencing part, headlight, and method of manufacture

An LED module includes a heat sink. The heat sink has a mounting surface that defines, with respect to ambient light incident thereon, one main direction of a beam perpendicular to the mounting surface and secondary directions of the beam inclined to the main direction of the beam at angles having absolute values smaller than or equal to 90 degrees. The heat sink also has a reflection surface oriented such that, with respect to the ambient light incident on thereon, a main direction of the beam of the reflection surface is perpendicular to the reflection surface and points in a direction included in the angle range determined by the main direction of the beam of the mounting surface and the secondary directions of the beam of the mounting surface. The LED module further includes an LED light source on the mounting face and pigments on the reflection surface.

LED module, LED module and reflector arrangement, and vehicle headlamp

A heatsink, a light-emitting diode (LED) module and a corresponding method of manufacture are described. A heatsink includes an electrically conductive heatsink core and an electrically insulating layer covering at least the first surface of the electrically conductive heatsink core. The electrically conductive heatsink core has a first pin that is integral with the electrically conductive heatsink core and protrudes from a first surface of the heatsink core. At least the first surface of the heatsink core is covered by an electrically insulating layer, which leaves at least portions of a lateral surface of the first pin exposed from the electrically insulating layer.

Heatsink with protruding pins and method of manufacture

Methods, apparatus and systems are described. An apparatus includes a module body made of a polymer material. The module body includes a mounting surface adjacent a potting area. At least two lead frame elements are embedded in the polymer material of the module body. Each of the at least two lead frame elements has a first terminal side and a second terminal side in the component potting area. An LED element is on the mounting surface of the module body and electrically coupled to the first terminal side of the at least two lead frame elements.

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Aachen, Germany

Marc Droegeler