Koninklijke Philips Corporation N.v.

Lumileds LLC

Lumileds Holding B.v.

Philips Intellectual Property & Standards Gmbh

Marc Andre De Samber

Norbertus Antonius Maria Sweegers

Floris Maria Hermansz Crompvoets

Hugo Johan Cornelissen

Mark Melvin Butterworth

Clarisse Mazuir

Achim Hilgers

Grigoriy Basin

Kenneth John Vampola

Brendan Jude Moran

Kwong-Hin Henry Choy

Patrick Zuidema

Filip Ilievski

Johann-Josef Kohl

Ralph-Hubert Peters

Johannes Antonius Adrianus Maria Van Heeswijk

Egbert Lenderink

Koen Van Os

A LED module is disclosed comprising a LED chip including at least one LED arranged to direct a luminous output centered about an optical axis towards a light exit surface; an optical layer separated from the light exit surface by a spacing region having a lower refractive index than the optical layer and a material comprising the light exit surface, the optical layer being arranged to redirect the luminous output in a direction under a non-zero angle with the optical axis; and a collimating element over the optical layer, the collimating element being arranged to collimate the redirected luminous output in said direction. A lighting module including one or more of such LED modules is also disclosed.

LED module and lighting module

The present invention relates to a lighting device, in particular a headlamp for vehicles, at least comprising an array of light sources, consisting of first and second light sources being mounted within the same flat or curved plane, and a projecting optical system arranged to project light emitted by the light sources in a forward direction of the lighting device. At least one shifting element is arranged in front of said first light sources. The shifting element generates real or virtual emission positions of the light of said first light sources shifted towards or away from the projecting optical system with respect to emission positions of said second light sources. With the proposed lighting device, in addition to the main lighting function of illumination, a pattern or signature can be projected at one or several additional image planes. The lighting device thus e.g. allows the additional projection of branding or safety patterns.

Lighting device with multiple-focus mode

Proposed is a light source comprising: a plurality of LED light sources, each of the plurality of LED light sources having: a semiconductor diode structure adapted to generate light; and a light output section above the semiconductor diode structure adapted to output light from the semiconductor diode structure, the area of the light output section being less than the area of the semiconductor diode structure; and an optically transmissive structure overlapping the light output sections of the plurality of LED light sources so as to receive light from the light output sections of the plurality of LED light sources and having a light exit section adapted to output the received light. The area of the light exit section of the optically transmissive structure is less than the footprint area of the plurality of LED light sources.

Light source

A method according to embodiments of the invention includes growing on a first surface of a sapphire substrate a semiconductor structure including a light emitting layer disposed between an n-type region and a p-type region. The semiconductor structure is formed into a plurality of LEDs. Cracks are formed in the sapphire substrate. The cracks extend from the first surface of the sapphire substrate and do not penetrate an entire thickness of the sapphire substrate. After forming cracks in the sapphire substrate, the sapphire substrate is thinned from a second surface of the sapphire substrate. The second surface is opposite the first surface.

Method of separating light emitting devices formed on a substrate wafer

A light emitting device such as luminaire includes one or more light emitting device chips mounted on a board. The light emitting device chips have electrical contacts and are flip chip mounted to board with the electrical contacts connected to contact pads. Sidewall metallizations on the sidewalls of the light emitting device chips are connected by metal heat transfer elements to heat dissipation regions of board. The metal heat transfer elements may be of solder which may be deposited using equipment conventionally used for attaching surface mount devices.

Light emitting device cooling

Embodiments of the invention include a semiconductor structure including a light emitting layer sandwiched between an n-type region and a p-type region. A growth substrate is attached to the semiconductor structure. The growth substrate has at least one angled sidewall. A reflective layer is disposed on the angled sidewall. A majority of light extracted from the semiconductor structure and the growth substrate is extracted through a first surface of the growth substrate.

Top emitting semiconductor light emitting device

A relatively large substrate has a reflective surface, such as a diffusive white surface. LED dies, either as bare LED dies or packaged LED dies, are mounted to the substrate to form separate arrays of LEDs. Each array is intended for a separate mixing chamber. A layer of an encapsulant, such as silicone, is deposited over the substrate to encapsulate the LED dies. A laser etches through the encapsulant to form slots, and a reflective material, such as a white paint, is deposited in the slots to form reflective walls of each mixing chamber. If desired, a phosphor layer is deposited over the encapsulant and reflective walls. The substrate is then singulated to separate out the mixing chambers. Since no discrete parts are assembled, and multiple mixing chambers are formed simultaneously, the resulting mixing chambers are inexpensive and very reliable.

LED mixing chamber with reflective walls formed in slots

Growing community of inventors

Aachen, Germany

Marc Andre De Samber