Visteon Global Tech., Inc

Ford Motor Company Limited

Visteon Global Technolgoies, Inc.

Marc Alan Straub

Lakhi Nandlal Goenka

Vivek Amir Jairazbhoy

Jay DeAvis Baker

Lakhi Nandial Goenka

Frank Burke DiPiazza

Andrew Zachary Glovatsky

Robert Edward Belke

Randy Claude Stevenson

Mohan R Paruchuri

Cuong Van Pham

Delin Li

Michael George Todd

Richard Keith McMillan

Thomas Bernd Krautheim

Ram S Raghava

Michael Allen Howey

A method for making multi-layer electronic circuit boards having &ldquo;blind&rdquo; type apertures which may be selectively and electrically grounded and further having selectively formed air bridges and/or crossover circuits

Circuit board and a method for making the same

A method for making multi-layer electronic circuit boards having metallized apertures which may be selectively and electrically grounded or isolated from an electrical ground plane.

Method for making an electrical circuit board

A nozzle which receives first and second materials and which has an outlet aperture The first material is received within the outlet aperture and is atomized by the second material within the outlet aperture before it is emitted from the nozzle and applied to a targeted location and/or object

Nozzle

A nozzle assembly including a first inlet aperture which receives material which is to be selectively emitted from assembly . Assembly includes an outlet aperture having several apertures , and which are respectively separated by substantially identical elements , and . Elements cooperatively form a plurality of passages or channels through assembly . A centrally disposed channel is relatively narrower than the other channels , and , and channels are relatively narrower than outermost channels , thereby causing material to be emitted at a substantially similar and/or uniform velocity at each point or location within outlet aperture

Nozzle assembly

A nozzle,including a member,which selectively receives a first material,and a second material,and which selectively atomizes the second material,by use of the first material,The nozzle,further includes a diffuser member,which receives the atomized second material,and which diffuses the received and atomized second material,while substantially, concomitantly, and tangentially applying the first material,to the diffused second material,thereby allowing the atomized second material,to be desirably deposited upon a target location,and/or object

A nozzle,having an outlet aperture,, the outlet aperture,having at least one injector,which is disposed within the aperture,and which injects a material,within the aperture,, effective to allow the material to be atomized and to be emitted from the aperture,at a substantially identical velocity at each point within the aperture

An interposer,for electrically coupling a semiconductor die,to a substrate,, comprising: an interposer body,made of a dielectric material and having a contact surface,and an opposed bonding surface,; a plurality of contact pads,arranged about the periphery of the contact surface,; a plurality of bonding pads,arranged across generally the entire area of the bonding surface,; and a plurality of electrically conductive conduits,disposed generally within the interposer body, such that each conduit,connects a respective one of the contact pads,with a respective one of the bonding pads,. The interposer,may also include: a sealed cooling channel,defined within the interposer body,; a fluid medium,generally filling the cooling channel,; and a piezoelectric element,attached to the interposer body such that the piezoelectric element communicates with the cooling channel,and the fluid medium,, the piezoelectric element being operatively coupled to at least two of the electrically conductive conduits

Interposer for mounting semiconductor dice on substrates

An apparatus for dispensing solder includes a nozzle body having a plurality of flow channels formed therein. Each flow channel includes an inlet end and a dispenser end for dispensing solder. The nozzle body forms a nipple surrounding each dispenser end, and the nozzle body further forms a shielding chamber in communication with each dispenser end for protecting the respective nipple, and optionally providing flow of inerting gas and/or excluding ambient oxygen from the soldering area. The nozzle bodies comprise micro-machined silicon. Various flow channel configurations are provided for improved flow characteristics.

Growing community of inventors

Dearborn Heights, MI, United States of America

Marc Alan Straub