International Business Machines Corporation

Marc A Taubenblatt

John Samuel Batchelder

Donald M DeCain

Philip C Hobbs

Maheswaran Surendra

John Z Colt, Jr

Nancy T Pascoe

Asif Ghias

Raymond James Bunkofske

James J McGill

Russell Alan Budd

Alexander V Rylyakov

Fuad Elias Doany

Clint Lee Schow

Daniel Michael Kuchta

Benjamin G Lee

Cuc Kim Huynh

Douglas P Nadeau

Robert A Jurjevic

Timothy Joseph Chainer

Pritish Ranjan Parida

Eugen Schenfeld

Joel Leonard Wolf

Nagui Halim

Yoonho Park

Nicolas Dupuis

Jonathan E Proesel

James R Giles

Xiaolan Zhang

Kirsten Weale Hildrum

Laurent Schares

Deepak Rajan

Rohit Wagle

Douglas W Cooper

Hermantha K Wickramasinghe

Clayton C Williams

Phillippe L Selo

A method of detecting and identifying road surface defects is provided. Motion and position information is received from a plurality of vehicles. A profile is retrieved for a particular vehicle from a database of vehicle profiles by using an identifier of the particular vehicle. One or more criteria are identified for detecting a particular type of road surface defect based on the retrieved profile of the particular vehicle. Upon determining that the received motion and position data satisfies the identified criteria, a detection of a road surface defect of the particular type and a location associated with the detected road surface defect based on the received position information is reported.

Detection of road surface defects

A structure to couple light to a waveguide is described. In an example, a light source of the structure may emit light from an emission point towards a lens of the structure. The light source may be disposed at a location such that the emission point of the light source is offset from a center of the lens. The lens may be integrated in a substrate of a structure comprising the light source. The lens may refract the light emitted from the emission point at an angle. The angle may be based on the offset between the emission point and the center of the lens. The structure may couple the refracted light to a coupler of the waveguide at an incident angle.

Photonic waveguide coupling using offset light source

An optical phase modulator includes an input source that is configured to receive a light source. There is an output operative to provide a phase modulated output signal based on the received light source. There is a first optical coupler configured to split the light source into a first optical path of a Mach Zehnder Interferometer (MZI) and a second optical path of the MZI. A static phase shifter is configured to provide a static phase shift to the first optical path. There is a phase modulator in the second optical path. There is a second optical coupler configured to combine the first optical path and the second optical path. The first and second optical couplers are tuned such that the phase modulated optical signal at the output provides a substantially constant amplitude that is independent of a change in loss introduced by the phase modulator.

Electro-optic phase modulator with no residual amplitude modulation

Methods an systems for low-power transmission include biasing an emitter in a non-linear operating range of the emitter near a threshold current of the emitter. A data signal is distorted to add a precursor pulse to a rising edge of a data waveform to quickly bring the emitter into a linear operating range. The distorted data signal is transmitted at the emitter.

Near-threshold optical transmitter pre-distortion

Processing for a silicon photonics wafer is provided. A silicon photonics wafer that includes an active silicon photonics layer, a thin buried oxide layer, and a silicon substrate is received. The thin buried oxide layer is located between the active silicon photonics layer and the silicon substrate. An electrical CMOS wafer that includes an active electrical layer is also received. The active silicon photonics layer of the silicon photonics wafer is flip chip bonded to the active electrical layer of the electrical CMOS wafer. The silicon substrate is removed exposing a backside surface of the thin buried oxide layer. A low-optical refractive index backing wafer is added to the exposed backside surface of the thin buried oxide layer. The low-optical refractive index backing wafer is a glass substrate or silicon substrate wafer. The silicon substrate wafer includes a thick oxide layer that is attached to the thin buried oxide layer.

Silicon photonics wafer using standard silicon-on-insulator processes through substrate removal or transfer

A method, system, and computer program product for implementing stream processing are provided. The system includes an application framework and applications containing dataflow graphs managed by the application framework running on a first network. The system also includes at least one circuit switch in the first network having a configuration that is controlled by the application framework, a plurality of processing nodes interconnected by the first network over one of wireline and wireless links, and a second network for providing at least one of control and additional data transfer over the first network. The application framework reconfigures circuit switches in response to monitoring aspects of the applications and the first network.

Method, system, and computer program product for implementing stream processing using a reconfigurable optical switch

A method and structure for controlling a manufacturing tool includes measuring different manufacturing parameters of the tool, transforming a plurality of time series of the manufacturing parameters into intermediate variables based on restrictions and historical reference statistics, generating a surrogate variable based on the intermediate variables, if the surrogate variable exceeds a predetermined limit, identifying a first intermediate variable, of the intermediate variables, that caused the surrogate variable to exceed the predetermined limit and identifying a first manufacturing parameter associated with the first intermediate variable, and inhibiting further operation of the tool until the first manufacturing parameter has been modified to bring the surrogate value within the predetermined limit.

User configurable multivariate time series reduction tool control method

The present invention is a contamination measuring device and method of using the same according to a Chemical Mechanical Polishing (CMP) brush cleaner equipment/technology. A collection device is mounted in a brush cleaning device for collecting effluent which flows off of a wafer. The effluent is passed to a particle counter which measures the contamination levels of the effluent. A computer stores the data collected by the particle counter and computes the particles per liter of effluent and provides real time data. The contamination of the effluent corresponds to the contamination of the brushes in the cleaning device and therefore is means for predicting when the brushes in the cleaning device should be replaced.

Downstream monitor for CMP brush cleaners

A method and apparatus for inspecting a repeating pattern on an object using an optical inspection system to detect variations in the pattern. The object is illuminated with substantially monochromatic light. A diffracted beam is formed. The diffracted beam has a plurality of polarization components. At least one of the polarization components of the diffracted beam is blocked. Variations in the pattern are detected as light intensity variations in the polarization components that are not blocked.

Method and apparatus for inspecting patterned thin films using

A heterodyne interferometer is combined with darkfield surface particle detection for improved surface particle detection sensitivity. The probe beam and the reference beam have different wavelengths. The reference beam may either be a real reference beam or a virtual reference beam. The probe beam may be incident at the surface at either a grazing angle or at an angle substantially normal to the surface. The real reference beam is incident at the surface at a grazing angle. The detection may either be conventional heterodyne detection or a combination of heterodyne and Lloyd's mirror detection.

Surface particle detection using heterodyne interferometer

Apparatus and a method for performing high resolution optical imaging in the near infrared of internal features of semiconductor wafers uses an optical device made from a material having a high index of refraction and held in very close proximity to the wafer. The optical device may either be a prism or a plano-convex lens. The plano-convex lens may be held in contact with the wafer or separated from the wafer via an air bearing or an optical coupling fluid to allow the sample to be navigated beneath the lens. The lens may be used in a number of optical instruments such as a bright field microscope, a Schlieren microscope, a dark field microscope, a Linnik interferometer, a Raman spectroscope and an absorption spectroscope.

Apparatus and a method for high numerical aperture microscopic

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Pleasantville, NY, United States of America

Marc A Taubenblatt