Primax Electronics Ltd.

Mao-Hsiu Hsu

Kuan-Pao Ting

Ying-Chieh Chuang

Chih-hao Hsu

Hsin-Tso Chen

Hong-Kai Huang

Li-Pin Wang

A fingerprint identification module includes a contact layer, at least one light source, at least one image sensor and a lens. The at least one light source emits at least one light beam. The contact layer is exposed outside the fingerprint identification module to be contacted with a user's finger. The at least one image sensor is located under the contact area. After the at least light beam is received by the at least one image sensor, a corresponding fingerprint image is generated. The lens is arranged between the contact layer and the at least one image sensor, and includes plural openings. The lens includes plural openings. After the at least one light beam is reflected by the finger, the at least one light beam is transmitted through the plural openings and projected to the at least one image sensor.

Fingerprint identification module

The present invention relates to a fingerprint identifying module, including a circuit board, a fingerprint sensing component, a cover plate, and a waterproof sleeve. The fingerprint sensing component is disposed on the circuit board, and the cover plate covers the fingerprint sensing component. The waterproof sleeve partially covers the cover plate and the circuit board, so as to prevent a foreign liquid from entering a space between the fingerprint sensing component and the circuit board. The cover plate includes a cover plate body and an extending portion. The cover plate body covers the fingerprint sensing component. The extending portion surrounds the cover plate body, is located between the waterproof sleeve and the fingerprint sensing component, and may block the foreign liquid from passing.

Fingerprint identifying module

The present invention provides a scooter handle having a fingerprint identification module. The scooter handle having a fingerprint identification module includes: an inner tube, an outer tube, and a fingerprint identification module. After collecting and determining a fingerprint of a user, the fingerprint identification module drives an electromagnetic module in the inner tube to engage the inner tube with the outer tube, so that the outer tube and the inner tube are interlocked.

Scooter handle with fingerprint identification module

A fingerprint identification module is provided for identifying a fingerprint of a finger. The fingerprint identification module includes a sensing chip and a thermally deformable layer. The thermally deformable layer is disposed over the sensing chip and includes a sensing region. When the finger is placed on the sensing region, the fingerprint of the finger is sensed by the sensing chip. If the fingerprint identification result of the fingerprint identification module fails, the thermally deformable layer is firstly changed to a molten state and then returned to a solidified state within a predetermined time period. Consequently, the finger is fixed by the thermally deformable layer.

Fingerprint identification module and mobile electronic device with same

A fingerprint identification module is installed in an accommodation space of an electronic device. The fingerprint identification module includes a circuit board, a fingerprint sensor and a resilient fixing plate. The fingerprint sensor is disposed on the circuit board, and detects a fingerprint image of a finger. The resilient fixing plate is located under the circuit board, connected with the circuit board, and contacted with a bottom side of the accommodation space. The resilient fixing plate is subjected to deformation and descended according to the accommodation space. Consequently, the fingerprint identification module installed in the accommodation space.

A fingerprint identifying module includes a sensing assembly, a cover and a metal ring. The cover has a protruding portion and the metal ring has an accommodation groove. The protruding portion of the cover is engaged with the accommodation groove of the metal ring so that the metal ring is bonded to the cover. Since no liquid glue is required for bonding the metal ring to the module, the step of baking and solidifying the liquid glue is saved and the manufacturing efficiency of the fingerprint identifying module is improved.

A jig for a fingerprint identification module includes a base, a top cover and a rotating shaft. The rotating shaft is connected with the base or the top cover. The base includes plural accommodation spaces. A circuit board and a fingerprint sensor fixed on the circuit board are accommodated within the corresponding accommodation space. The top cover is fixed on the base in response to a magnetic attraction force. The top cover includes plural perforations corresponding to the plural accommodation spaces. When an output element is penetrated through a specified perforation, an isolation material is outputted from the output element and placed on a periphery of a junction between the circuit board and the fingerprint sensor.

Jig and manufacturing method for fingerprint identification module

A method for manufacturing a fingerprint identification module is provided. In a step (a), a fingerprint sensor comprising a substrate, a sensing chip and a package layer is provided. The sensing chip is disposed on the substrate. The sensing chip is encapsulated by the package layer. In a step (b), an ink material is coated on the package layer, so that a color ink layer is formed on the package layer. In a step (c), a stamping tool is used to stamp the color ink layer, so that a top surface of the color ink layer becomes a first high gloss surface. In a step (d), the color ink layer to be heated through baking or irradiated with UV light, so that the color ink layer is hardened.

Fingerprint identification module and manufacturing method thereof

A method for assembling the fingerprint identification module is provided. Firstly, a protective cover and a fingerprint sensing element are combined together. Then, the fingerprint sensing element is placed on the circuit board. Then, a triggering element is placed on the circuit board. Then, an adhesive thickness is obtained according to a predetermined thickness and the thicknesses of the protective cover, the fingerprint sensing element, the triggering element and the circuit board. Then, an adhesive film corresponding to the adhesive thickness is placed on the circuit board. Since the appropriate adhesive film is selected according to the demand, the thickness of the fingerprint identification module is substantially identical to the predetermined thickness.

Method for assembling fingerprint identification module

A method for assembling a fingerprint identification module is provided. During the process of cutting a sensing strip, the junction parts between adjacent fingerprint sensors are retained. Consequently, the cut sensing strip is still a one-piece structure. Then, a paint-spraying process is performed to spray paint on the one-piece structure of the sensing strip. After the junction parts are removed, plural individual fingerprint sensors are produced. In comparison with the conventional technology of spraying paint on the individual fingerprint sensors, the assembling time of the method of the present invention is largely reduced. Consequently, the production efficiency of the present invention is enhanced.

The present invention relates to a fingerprint identifying module, including a fingerprint identifying and sensing element, a support board, and a metal ring. The support board may bear the fingerprint identifying and sensing element thereon, and includes an accommodation groove. The metal ring is sleeved on the fingerprint identifying and sensing element and the support board. Moreover, the metal ring includes a fixing column which is formed by extending a lower surface of the metal ring, so as to extend into the accommodation groove to fix the metal ring on the support board. The fingerprint identifying module of the present invention strengthens bonding between the metal ring and the support board by bonding the fixing column and the accommodation groove.

A method for assembling a fingerprint identification module is provided. During the process of cutting the sensing strip, the thin junction slices between the fingerprint sensors are retained. Consequently, the size of the top surface of the fingerprint sensor is close to a predetermined size. After the thin junction slices are cut, the concave structures are formed on the bottom surfaces of the fingerprint sensors. Consequently, the size of the bottom surface of the fingerprint sensor is smaller than the size of the top surface of the fingerprint sensor. Even if the cutting skew is generated during the cutting process, the fingerprint sensor can pass the size test. Consequently, the production efficiency is enhanced.

Method for assembling fingerprint identification module and fingerprint sensor cutting method

An optical fingerprint identification module includes a casing, an image pickup assembly, a light-guiding diffusion layer, a light-collecting reflective layer, a press plate, a light source and an optical tunnel structure. The optical tunnel structure is located under the press plate and located over the image pickup assembly. The optical tunnel structure is penetrated through the light-collecting reflective layer and a part of the light-guiding diffusion layer. After a light beam emitted by the light source is introduced into the light-guiding diffusion layer, the light beam is guided and diffused by the light-guiding diffusion layer and collected and reflected by the light-collecting reflective layer. Consequently, the light beam is transferred between the light-guiding diffusion layer and the light-collecting reflective layer. After the light beam is irradiated on the press plate through the optical tunnel structure, the light beam is reflected to the image pickup assembly.

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Taipei, Taiwan

Mao-Hsiu Hsu