Intel Corporation

Mao Guo

Yong She

Hyoung Il Kim

Sireesha Gogineni

Bin Liu

Bilal Khalaf

Richard Patten

John G Meyers

Tyler Leuten

Yuhong Cai

Min-Tih Ted Lai

Lingyan L Tan

Jh Yoon

Apparatuses, systems and methods associated with integrated circuit (IC) package design are disclosed herein. In embodiments, an IC package may include a first die and a second die. The IC package may include a spacer located between the first die and the second die, the spacer includes glass, and a molding compound that at least partially encompasses the first die, the second die, and the spacer. Other embodiments may be described and/or claimed.

Integrated circuit package with glass spacer

Electronic device package technology is disclosed. In one example, an electronic device includes a substrate having a bond finger, a die coupled to the substrate and having a bond pad, a first bond wire coupled between the bond pad and the bond finger, and a second bond wire coupled between the bond pad and the bond finger. The first bond wire is reverse bonded between a pad solder ball on the bond pad and a finger solder ball on the bond finger. The second bond wire is forward bonded between a supplemental pad solder ball on the pad solder and the bond finger adjacent the finger solder ball. Associated systems and methods are also disclosed.

Electronic device packages and methods for maximizing electrical current to dies and minimizing bond finger size

A system in package and method of making as system in package are disclosed. The system in package has a substrate () with a plurality of passive devices () mounted thereon. A molding compound () envelopes the plurality of passive devices () to define a flat surface () substantially parallel to a surface of the substrate (). A plurality of integrated circuit dies () is coupled successively to the flat surface ().

Pre-molded active IC of passive components to miniaturize system in package

A microelectronic structure () and a fabrication method of microelectronic are described. A first package () has a first conductive pad () formed on a first foundation layer (). A loop of conductive wire (-) is wirebonded to the first conductive pad (() of the first foundation layer (). A mold cap () is formed on the first foundation layer (). A via (-) is formed in the mold cap () to reach the conductive wire (-). A solder structure (-) is coupled to the conductive wire (-). A second package () is connected to the first package () by attaching a second solder structure (-) of a second package () to the first solder structure (-) of the first package ().

Conductive wire through-mold connection apparatus and method

Substrates, assemblies, and techniques for enabling multi-chip flip chip packages are disclosed herein. For example, in some embodiments, a package substrate may include a first side face; a second side face, wherein the second side face is opposite to the first side face along an axis; a portion of insulating material extending from the first side face to the second side face; wherein a cross-section of the portion of insulating material taken perpendicular to the axis has a stairstep profile. Solder pads may be disposed at base and step surfaces of the portion of insulating material. One or more dies may be coupled to the package substrate (e.g., to form a multi-chip flip chip package), and in some embodiments, additional IC packages may be coupled to the package substrate. In some embodiments, the package substrate may be reciprocally symmetric or approximately reciprocally symmetric.

Substrates, assembles, and techniques to enable multi-chip flip chip packages

In some forms, an electronic assembly includes a substrate; and a ball pad mounted on the substrate, wherein the ball pad includes a plurality of lobes projecting distally from a center of the ball pad. In some forms, he electronic assembly includes a substrate; and a ball pad mounted on the substrate, wherein the ball pad includes a lobe projecting distally from a center of the ball pad. In some forms, the electronic assembly includes a substrate; and a ball pad mounted on the substrate, wherein the ball pad includes at least one lobe projecting distally from a center of the ball pad; and an electronic package that includes at least one conductor that electrically connects the ball pad on the substrate to the electronic package.

Ball pad with a plurality of lobes

Electronic device package technology is disclosed. An electronic device package in accordance with the present disclosure can include a package substrate, an electronic component, a mold compound encapsulating the electronic component, and a redistribution layer disposed such that the mold compound is between the package substrate and the redistribution layer. The redistribution layer and the package substrate can be electrically coupled. In addition, the redistribution layer and the electronic component can be electrically coupled to electrically couple the electronic component and the package substrate. Associated systems and methods are also disclosed.

Growing community of inventors

Shanghai, China

Mao Guo