Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Technische Unversität Berlin

Manuel Seckel

Andreas Ostmann

Thomas Löher

Dionysios Manessis

Rainer Patzelt

The invention relates to a method for generating an electronic system for application to freeform surfaces, a method for producing freeform surfaces having an electronic system, and an electronic system and a combination of a freeform surface having at least one such system. According to the invention, an elastic interconnect device having an elastic substrate and an elastic, fanned-out contact structure with contact surfaces comprised of conductor lines is generated first. Then, electronic components are mounted on the interconnect device. Finally, the interconnect device is encapsulated. If a freeform surface with an electronic system is to be generated, the electronic system produced in this way is then mounted on the previously provided freeform surface.

Method for generating an electronic system, method for generating a freeform surface having such a system, and electronic system and freeform surfaces having such a system

The present invention relates to a method for the production of an expandable circuit carrier in which a starting material for an expandable substrate is applied on an electrically conductive foil which forms an expandable substrate layer which is connected to the foil, after which the foil is structured such that it forms a conductor structure having at least one expandable strip conductor. The present invention further relates to an expandable circuit carrier which can be produced by the method.

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Berlin, Germany

Manuel Seckel