Multitest Elektronische Systeme Gmbh

Manuel Petermann

Stefan Kurz

Gerhard Gschwendtberger

Maximilian Schaule

Marcus Frey

Volker Leikermoser

Andeas Nagy

Gabriela Born

Thomas Fritsche

A contact tip for a sequential test of electronic components comprises a base material and a hard material, wherein the base material and the hard material are fixed to each other and wherein the hard material has a thickness of at least 0.03 mm. The contact tip may be the contact tip of a contact element used for a sequential test of electronic components. A method of producing a contact tip of a contact element used for a sequential test of electronic components, comprises: Providing a plate made up of a base material and a hard material, wherein the base material and the hard material are fixed to each other; Cutting the plate along a cut line to form the contact tip wherein the cut line runs through the base material and the hard material and wherein the hard material has a thickness of at least 0.03 mm in a section where the cut line cuts the hard material.

Contact tip and contact element and method of producing the same

A contact spring for a testing base for high current testing of an electronic component, which is produced from a spring metal sheet of a predetermined thickness and possesses two identical opposing lateral faces, and which has a spring arm and a testing arm with a testing tip, where the testing arm forms an angle with the spring arm, which enables the testing tip to be positioned on a contact surface of the electronic component running approximately parallel to the spring arm, by relative movement between the testing base and the electronic component.

Contact spring for a testing base for the high current testing of an electronic component

In the case of a test apparatus for testing electronic components which are present in an assembly, in particular in the form of strips, a slide-like contacting board supporting device, to which the contacting board can be fastened, is mounted on the test head. The contacting board supporting device can be moved parallel to the plane of the contacting board when the contacting nest is docked on the test head, with the result that the contacting board can be brought into different test positions which are laterally beside one another.

Test apparatus for the testing of electronic components

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Rosenheim, Germany

Manuel Petermann