Commissariat &#xc0; L'&#xc9;nergie Atomique Et Aux &#xc9;nergies Alternatives

Commissariat a L'energie Atomique

Office National D'etudes Et De Recherches Aerospatiales

Centre National De La Recherche Scientifique

Cirtes Src

Onera

Manuel Fendler

Francois Marion

Gilles Lasfargues

Claude Barlier

Nicolas Guerineau

Guillaume Druart

Emmanuel Hugot

Abdenacer Ait-Mani

Florence De La Barriere

Cyril Pelaingre

Cécile Davoine

Alain Gueugnot

Sylvain Rommeluere

Yann Gaeremynck

Gilles Lafargues

Delphine Dumas

Rémy Kalmar

A bellows including a cylindrical and corrugated side wall, extending about a longitudinal axis, the side wall including: an alternation of crests and of troughs, forming corrugations; flanks, each flank extending between a crest and a trough, each corrugation having a first flank and a second flank that are opposite, separated by a same trough; the bellows includes at least one elementary electrical circuit associated with a corrugation, the elementary electrical circuit includes a first conductive element and a second conductive element, extending along the first flank and/or the second flank, the first conductive element being separated from the second conductive element; a first conductive track and a second conductive track, linked respectively to the first conductive element and to the second conductive element, and the first conductive track and the second conductive track are configured to be connected, to a detector of closure of the elementary electrical circuit.

Protective bellows having an electrical circuit and covering for a mechanical joint

An instrumented mold formed by an assembly of strata includes, within the assembly of strata, a measurement structure provided with at least one pressure sensor and/or at least one temperature sensor or any other sensor capable of measuring a physical quantity, the structure typically being in the form of a flexible support housed between two strata.

Additively manufactured mold with a sensor

An optical detector with a curved detection surface is provided, including a photosensitive sensor; a support imposing a curvature on the photosensitive sensor; and a glue layer, provided between the photosensitive sensor and the support, with a thickness higher than 50 &#x3bc;m. The glue layer with a high thickness enables requirements imposed on the sensor to be reduced, with an equal radius of curvature, and thus a minimum radius of curvature of the photosensitive sensor to be reduced, thereby compensating for significant defects of an imaging system located upstream.

Optical sensor having a curved detection surface

A micro-machined optical measuring device including: a set of photosensitive detector elements situated on a given face of a first support; a second support, assembled to the first support, forming a prism and including a first face through which a visible radiation is intended to penetrate and a second face, forming a non-zero angle &#x3b8; with the first face and a non-zero angle &#x3b1; with the given face of the first support, the second face being semi-reflective, the first support and the second support being positioned such that an interferometric cavity is made between the second face and the given face, the distance between the given face of the first support and the second face of the second support varying regularly.

Micro-machined imaging interferometer having a static interferometric cavity

Infrared imagery device with integrated shield against parasite infrared radiation, and method of manufacturing the device. This device comprises a support provided with an infrared radiation detector, at least one optical device facing the detector, and a shield against parasite radiation. The shield comprises at least two continuous beads, spaced from each other, extending from the support as far as the optical device, provided with vents and made of a material that significantly attenuates parasite radiation, penetrating laterally between the support and the optical device. The two beads with their ventsform a baffle. The device is manufactured using the flip chip technique.

Infrared imagery device with integrated shield against parasite infrared radiation and method of manufacturing the device

The invention relates to a system and method for positioning and passively aligning at least one optical component as close as possible to an electromagnetic radiation detector. This system comprises supporting wedges () for Z positioning of the optical component () as close as possible to the detector () and passive X and Y alignment means via holding wedges and/or holding balls (), the X, Y and Z axes being axes perpendicular to each other.

Detector system with an optical function and method for making such a system

A method of electrical connection between a series of hard conductive points and corresponding pads arranged on a one face of a first component, and a series of buried ductile conductive bumps and corresponding pads arranged on one face of a second component. The method comprises forming said series of hard conductive points on said face of the first component; forming said series of buried ductile conducting bumps on said face of the second component; inserting said series of hard conductive points in said series of buried ductile conducting bumps at an ambient temperature; and directly sealing the first and second components together.

Component with buried ductile conductive bumps and method of electrical connection between said component and a component equipped with hard conductive points

This method for producing a non-plane comprises fitting a flexible component onto a carrier by means of hybridization columns, each column having a first height and including a volume of solder material formed between two surfaces wettable by said solder material added to the flexible component and to the carrier respectively, said wettable surfaces being surrounded by zones non-wettable by the solder material, the wettable surfaces and the volume of solder material being determined as a function of a second height required for the flexible component relative to the carrier at the place where the column is formed, such that the column varies from the first height to the second height when the volume of material is brought to a temperature higher than or equal to its melting point and heating the volumes of solder material of the columns to a temperature higher than or equal to the melting point of said material in order to melt it.

Method for producing a non-plane element

The invention concerns a method of collective bonding of individual chips on a strained substrate (), which comprises the following steps: functionalised layers () are arranged on a support (), in an adjacent non-contiguous manner, with a space e between two neighboring layers (), a calibrated drop of adhesive () is deposited on each of these functionalised layers, the strained substrate () is transferred onto these drops of adhesive, the parts of the assembly thereby formed are singularized to produce chips () bonded to the surface of strained substrate. The invention also concerns a method of placing under strain a semiconductor reading circuit by a substrate in a material of different coefficient of expansion.

Growing community of inventors

Grenoble, France

Manuel Fendler