Analog Devices,inc.

Manolo G Mena

Thomas M Goida

Dipak Sengupta

Jicheng Yang

Jia Gao

Asif Chowdhury

Carlo Tiongson

Elmer S Lacsamana

John R Martin

Maurice S Karpman

Lawrence E Felton

William A Webster

Richard Sullivan

Rick Sullivan

Michael P Duffy

Packaged integrated devices and methods of forming the same are provided. In one embodiment, a packaged integrated device includes a package substrate, a package lid, and an integrated circuit or microelectromechanical systems (MEMS) device. The package lid is mounted to a first surface of the package substrate using an epoxy, and the package lid and the package substrate define a package interior. The package lid includes an interior coating suited to good adhesion with the epoxy, and an exterior coating suited to RF shielding, where the materials of the interior and exterior coatings are different. In one example, the interior lid coating is nickel whereas the exterior lid coating is tin.

Packages and methods for packaging

Packages and methods for packaging using a lid having multiple conductive layers

A method of producing a MEMS device removes the bottom side of a device wafer after its movable structure is formed. To that end, the method provides the device wafer, which has an initial bottom side. Next, the method forms the movable structure on the device wafer, and then removes substantially the entire initial bottom side of the device wafer. Removal of the entire initial bottom side effectively forms a final bottom side.

Method of producing a MEMS device

Growing community of inventors

Quezon, Philippines

Manolo G Mena