Electro Scientific Industries, Inc.

Uvcleaning Systems, Inc.

Manoj Kumar Sammi

Yunlong Sun

Mark Douglas Owen

James Thorne

Edward J Swenson

Jay Johnson

Doug J Garcia

John D Stackpole

Rupendra M Anklekar

In order to disinfect and to detoxify a fluid, a photoreactor contains at least two light sources. One light source activates the catalytic function of a semiconductor material in the fluid to reduce the concentration of contaminants in the fluid, such as by breaking down organic contaminants into non-toxic compounds. A second light source acts directly on living biological entities to sterilize or kill them and thereby disinfect the fluid, and can also serve to activate a semiconductor photocatalyst that in turn causes further damage to biological contaminants. The semiconductor photocatalyst is desirably attached to an optically transmitting fiber substrate in the fluid. The second light source in one embodiment is external to the fluid and illuminates the photocatalyst through transmitting surfaces in a fluid containment vessel. The light sources can comprise respective sets of plural LEDs.

Ultraviolet photoreactor for the purification of fluids

A method of forming a scribe line having a sharp snap line entails directing a UV laser beam along a ceramic or ceramic-like substrate such that a portion of the thickness of the substrate is removed. The UV laser beam forms a scribe line in the substrate without appreciable substrate melting so that a clearly defined snap line forms a region of high stress concentration extending into the thickness of the substrate. Consequently, multiple depthwise cracks propagate into the thickness of the substrate in the region of high stress concentration in response to a breakage force applied to either side of the scribe line to effect clean fracture of the substrate into separate circuit components. The formation of this region facilitates higher precision fracture of the substrate while maintaining the integrity of the interior structure of each component during and after application of the breakage force.

Method of forming a scribe line on a passive electronic component substrate

A method of forming a scribe line having a sharp snap line entails directing a UV laser beam along a ceramic substrate such that a portion of the thickness of the ceramic substrate is removed. The UV laser beam forms a scribe line in the ceramic substrate in the absence of appreciable ceramic substrate melting so that a clearly defined snap line forms a region of high stress concentration extending into the thickness of the ceramic substrate. Consequently, multiple depthwise fractures propagate into the thickness of the ceramic substrate in the region of high stress concentration in response to a breakage force applied to either side of the scribe line to effect clean breakage of the ceramic substrate into separate circuit components. The formation of this region facilitates higher precision breakage of the ceramic substrate while maintaining the integrity of the interior structure of each component during and after application of the breakage force.

Method of forming a scribe line on a ceramic substrate

A laser beam () cuts through a component carrier mask () made of thin elastomeric material such as silicone rubber to form slots () having slot openings of a desired shape. In a preferred embodiment, a light absorptivity enhancement material such as iron oxide introduced into the silicone rubber causes formation of a flexible support blank that operationally adequately absorbs light within a light absorption wavelength range. A beam positioner () receiving commands from a programmed controller causes a UV laser beam of a wavelength that is within the light absorption wavelength range to cut into the mask multiple slots with repeatable, precise dimensions. Each of the slots cut has opposed side margins that define between them a slot opening of suitable shape to receive a miniature component () and to exert on it optimal holding and release forces.

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Beaverton, OR, United States of America

Manoj Kumar Sammi