Intel Corporation

Manjit Dhindsa

Thomas John Fitzgerald

Matthew J Schaenzer

Carl L Deppisch

Mark Norwil

Tim A Renfro

Vaibhav P Trivedi

An electronic assembly includes a substrate, a device attached to the substrate, and a thermally conductive heat spreader covering the device and at least a portion of the substrate. A metal substantially fills the space between the device and the thermally conductive heat spreader. A method includes attaching at least one die to a substrate, placing a thermally conductive heat spreader over the die, and injecting a molten metal material into the space between the thermally conductive heat spreader and the die.

Electronic packaging apparatus and method

The base of a heat sink may be selectively plated with a solder wetting material and soldered to an integral heat spreader also selectively plated with gold. In another embodiment, the solder may be applied in the form of an insert made up of an electrical heating wire sandwiched between indium foil which acts as solder when heated by the intervening wire.

Thermally coupling an integrated heat spreader to a heat sink base

Growing community of inventors

Phoenix, AZ, United States of America

Manjit Dhindsa