Fujifilm Corporation

Manjirou Watanabe

Yoshihisa Negishi

A method for manufacturing solid-state imaging device for collectively manufacturing a multiplicity of solid-state imaging devices at a wafer level, the method including: a step of reducing the thickness of a cover glass wafer () after providing a mask material () to the cover glass wafer () including frame-shaped spacers (); a step of releasing the mask material () and laminating a first support wafer () through a lamination member (); a step of positioning and bonding a silicon wafer () and the cover glass wafer (), the silicon wafer () including a second support wafer () laminated on the back side through a lamination member (); a step of dicing the cover glass wafer () into cover glasses () by a whetstone (); and a step of dicing the silicon wafer () by a whetstone ().

Method for manufacturing solid-state imaging device

In a method for cutting a solid-state image pickup device of the present invention, a glass cover plate is diced with a surface thereof being protected, so that chipping of the glass cover plate can be significantly prevented. In addition, since a CCD wafer is adhered after the glass cover plate is diced, no glass fragments scattered due to chipping of the glass cover plate touch the CCD wafer, or cause damage to the CCD wafer, thereby a cutting of solid-state image pickup device can be achieved with high accuracy and high quality.

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Saitama, Japan

Manjirou Watanabe