Motorola Corporation

Motorola Mobility LLC

Google Inc.

Maninder Singh Sehmbey

Alberto R Cavallaro

David R Zeiger

Rachid M Alameh

Martin Rabindra Pais

Mark A Barabolak

Morris B Bowers

Paul B Crosbie

Robert A Zurek

Steve C Emmert

Yongho Lim

Gaurav Gupta

Krishna K Bellamkonda

Kurt A Estes

Kevin J McDunn

Giles T Davis

Aaron L Dietrich

David A Winkler

Ngee Jenn Lee

James J Morikuni

Michael W Schellinger

Brett L Robertson

Loren Francis Root

Gary K Mui

Michael F Spence

James Pey Chen

Pavana Abhiram Sirimamilla

Pongpinit Towashiraporn

Jim Cathey

An electronic device includes a device housing and heat generating electronics situated within the device housing. A thermally insulating screen defined by thermally insulating material is positioned on an exterior of the device housing. The thermally insulating screen defines a partition between the exterior of the device housing and external objects contacting the electronic device while allowing thermal energy from the heat generating electronics to dissipate through the device housing between instances of the thermally insulating material.

Electronic device with thermally insulating material instances and corresponding methods

A wearable electronic device includes a first device housing coupled to a second device housing by at least one strap. The wearable electronic device includes heat generating electronics situated within the first device housing. A heat pipe thermally coupled to the heat generating electronics transfers thermal energy from the heat generating electronics through the at least one neck strap to the second device housing.

Wearable electronic device with thermal energy transfer system and corresponding methods

In aspects of processor heat dissipation in a stacked PCB configuration, a computing device includes a processor for executable instructions processing during which the processor generates heat. The computing device also includes a main printed circuit board (PCB) in a stacked PCB configuration, and the processor is affixed to the main printed circuit board. The stacked PCB configuration forms an enclosed cavity through which heat dissipation is restricted. The computing device includes a heat spreader having a first end connected to the processor via the main printed circuit board by a conductive material, and a second end connected to a heat sink located external to the stacked PCB configuration. The heat spreader exits the enclosed cavity via an opening in the enclosed cavity between the stacked PCB configuration, and the heat spreader transfers the heat away from the processor to the heat sink.

Processor heat dissipation in a stacked PCB configuration

An electronic device includes a first device housing coupled to a second device housing by a hinge. A heat spreader is coupled to the first device housing and the second device housing and spans the hinge. A flexible display coupled to the first device housing and the second device housing and spans the hinge. The heat spreader and the flexible display can be coupled to the first device housing and the second device housing, respectively, at different locations. Alternatively, the flexible display can be coupled to the heat spreader at a location that is collocated with the location at which the heat spreader is coupled to the first device housing and the second device housing, respectively.

Hinged electronic device with flexible display and heat spreader

An electronic device includes a microphone coupled to a first substrate, a second substrate defining an acoustic port, and a pressure relief device situated between the first substrate and the second substrate. The pressure relief device includes a bore defining an acoustic duct through which the microphone receives acoustic energy from the acoustic port. The pressure relief device also includes a venting section. The venting section breaches the acoustic duct when a pressure within the acoustic duct exceeds a predefined pressure threshold.

Pressure relief device for microphone protection in an electronic device and corresponding methods

A method, a system, and computer program product for calculating an effective heat transfer coefficient of a device. The method includes measuring: an internal temperature of the device, a first temperature at a first location along a first resistive path of a parallel resistive network and a second temperature at a second location along a second resistive path of the parallel resistive network. An ambient temperature of the environment and an effective heat transfer coefficient of the device is then calculated based on the internal temperature, the first temperature, the second temperature, and resistive properties of the parallel resistive network. The ambient temperature and the effective heat transfer coefficient are provided to a thermal management component.

Calculating an effective heat transfer coefficient of a device

An apparatus detects a free-fall state of an electronic device, determines an orientation of the electronic device with reference to gravity when the free-fall state is detected, and predicts that the electronic device will strike a surface within a critical angle range. The prediction is based on the detection of the free-fall state and on the orientation of the electronic device. An electromagnetic torque is generated within the electronic device that re-orients the electronic device outside the critical angle. The apparatus comprises a processing system, a free-fall sensor coupled to the processing system, an orientation sensor coupled to the processing system, a magnetic-field generator, and a first coil that is electrically coupled to the processing system.

Imposing a rotational force during a drop of an electronic device to reduce breakage

An electronic device has a housing, at least one actuator attached to the housing, and a deformable skin having air pores. The actuators are attached to both the housing and the deformable skin to impart a motion that causes a varying amount of separation. A thermal exchange cavity is defined by the housing and the deformable skin. A skin oscillation controller is contained with the housing and is electrically connected to the at least one actuators that vary a volume of the thermal exchange cavity by deforming the deformable skin, causing an exchange of ambient air through the air pores to convectively cool the housing.

Skin oscillation convective cooling

An electronic system performs thermal management during its operation by proactively taking into account expected solar thermal loading. According to one embodiment, the electronic system determines its location and a solar thermal load value expected to affect its location. The system also determines a temperature offset value based on the solar thermal load value and predicts a future temperature for the system based on the temperature offset value and a then-current temperature for the system (e.g., as may be detected by one or more temperature sensors). The electronic system compares the predicted temperature to at least one threshold and executes a thermal mitigation procedure in the event that the predicted temperature exceeds one or more of the thresholds. According to another embodiment in which the electronic system is transportable, the determined solar thermal load value may include a solar thermal load profile for the system's expected route of travel.

Electronic system and method for thermal management therein taking into account solar thermal loading

An improved electronic communications systemfeatures a holder assemblysuch as a mobile computing device dock stationand dock heat exchanger providing an external heat sinkwhich when coupled with a user-friendly heat transfer devicesuch as a heat pipe can transfer heat from internal electronic componentsandand an internal heat sinkof an electronic communications device, such as a cellular phone or mobile computing device, via a special headset jack-heat pipe interfaceto help cool the electronic communications device. The electronic communications devicecan also include one or more thermal couplings-for coupling and providing a thermal pathway(s) from at least one of the internal electronic componentsandto the internal heat sink

Mobile computing device dock station with headset jack heat pipe interface

An optical communication system is provided for conveying signals between multiple housing elements of a device, where respective optical detectors and optical light sources interact via respective point to point communication paths, where the point to point communication path is maintained while the multiple housing elements of the device move relative to one another. In at least some instances, the multiple housing elements correspond to at least a pair of housing elements that are incorporated as part of a communication device having a slider configuration. In some of the same or still further instances, the point to point communication paths correspond to channels formed between the multiple housing elements, which in some instances may be at least partially recessed within one or both of the housing elements. In some instances the channels may traverse free space. In still further instances the channel may include a light pipe.

Point to point optical communication system for conveying signals between multiple housings of a device

An improved plug connector () is disclosed. It includes: a generally U-shaped contact () including a first vertical leg (), a second vertical leg () and a horizontal leg () connecting the first vertical leg ()and the second vertical leg (), the first vertical leg () being longer than the second vertical leg (); and a retention block 110 connected to both sides () and () of the horizontal leg () configured to support the U-shaped contact ().This design can stand up to the harsh environment that it will be exposed to and will provide improved resistance to failure.

Resilient plug connector

An electronic device [] includes a housing [] for containing circuitry [] that generates a light beam. The electronic device includes pivotal portions [] of the housing. A light receiver [] is associated with one of the housing pivotal portions. A light redirecting mechanism [] is mounted at a predetermined location of the housing other than to the one pivotal portion thereof and is configured to redirect the light beam in a plurality of predetermined optical paths in which the light receiver is disposed with relative pivoting between the housing pivotal portions.

Light transfer apparatus for an electronic device

An optical communication system () for transmitting light between a first housing () and a second housing () of a device () is provided. The first housing and the second housing are adapted to move relative to one another between a plurality of usage positions. The optical communication system includes a first optical communication element (), a second optical communication element (), and an optical waveguide (). The first optical communication element is capable of emitting light and can be coupled to one of the first and second housing. The second optical communication element is capable of receiving the light and can be coupled to the housing to which the first optical communication element is not coupled. The optical waveguide is capable of conveying the light emitted by the first to the second optical communication element. The second optical communication element can substantially encompass a locus of the output light.

Growing community of inventors

Wheeling, IL, United States of America

Maninder Singh Sehmbey