Intel Corporation

Mani Prakash

George Vergis

Xiang Li

Jeffory L Smalley

Phil Geng

Susan F Smith

David J Llapitan

Thu Huynh

Zhichao Zhang

Sanka Ganesan

James K Pickett

Ram S Viswanath

Rajasekaran Swaminathan

Brian S Morris

Bruce Querbach

Dong Wang

Gaurav Chawla

Dimitrios Ziakas

Bassam N Coury

Kuang C Liu

Woojong Han

Gregorio R Murtagian

Mohamed Arafa

Tao Liu

Chong J Zhao

Vijaykumar Krithivasan

Jonathan W Thibado

John M Lynch

John K Grooms

Edward L Payton

Harvey R Kofstad

Henry C Bosak

Thomas T Holden

Almanzo T Ortiz

An embodiment of a latch apparatus for a circuit board comprises a first latch body with a retention mechanism for the circuit board, a second latch body with a coupling mechanism for a connector, and a spring mechanism mechanically coupled between the first latch body and the second latch body. Other embodiments are disclosed and claimed.

Retention latch with spring mechanism

A connector includes mounting tabs that are extended relative to traditional mounting tabs. On a back side of the printed circuit board (PCB), the mounting tabs connect to a back plate. The mounting tabs extend through the PCB and connect with the back plate, which provides improved structural integrity. Depending on the connector, the use of the mounting tabs can use existing mounting holes for the connector and remove the need for additional mounting holes.

Connector retention mechanism for improved structural reliability

A memory module connector includes a memory module receiving slot configured to receive a memory module. The memory module connector further includes a restraining mechanism configured to release the memory module if a force applied by the memory module to the restraining mechanism is above a pre-determined force threshold.

Memory module connector, memory module, and pivotable latch

An embodiment of a connector housing for a circuit board may include a connector body to receive the circuit board, and a relaxation mechanism mechanically coupled to the connector body to relax stress on the connector housing and maintain the circuit board received in the connector body under a load which exceeds a load threshold. Other embodiments are disclosed and claimed.

Connector with relaxation mechanism for latch

Methods and apparatus related to supporting both DDR (Double Data Rate) and NVM (Non-Volatile Memory) DIMM (Dual Inline Memory Module) on the same memory slot are described. In one embodiment, a DIMM comprises volatile memory and non-volatile memory, and data is communicated with the volatile memory and the non-volatile memory via a single memory slot. Other embodiments are also disclosed and claimed.

Supporting multiple memory types in a memory slot

An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first passive heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second passive heat exchanger disposed on the at least one secondary device; at least one first spring operable to apply a force to the first heat exchanger in a direction of the primary device; and at least one second spring operable to apply a force to the second heat exchanger in the direction of the secondary device. A method including placing a passive heat exchanger on a multi-chip package, and deflecting a spring to apply a force in a direction of an at least one secondary device on the package.

Multi-chip self adjusting cooling solution

An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second heat exchanger disposed in the opening on the at least one secondary device; at least one heat pipe coupled to the first heat exchanger and the second heat exchanger. A method including placing a heat exchanger on a multi-chip package, the heat exchanger including a first portion, a second portion and at least one heat pipe coupled to the first portion and the second portion; and coupling the heat exchanger to the multi-chip package.

Heat sink coupling using flexible heat pipes for multi-surface components

Embodiments of the present disclosure are directed towards a socket loading element and associated techniques and configurations. In one embodiment, an apparatus may include a loading element configured to transfer a compressive load from a heat spreader to a socket assembly, wherein the loading element is configured to form a perimeter around a die when the loading element is coupled with an interposer disposed between the die and the socket assembly and wherein the loading element includes an opening configured to accommodate the die. Other embodiments may be described and/or claimed.

Socket loading element and associated techniques and configurations

Configurable central processing unit (CPU) package substrates are disclosed. A package substrate is described that includes a processing device interface. The package substrate also includes a memory device electrical interface disposed on the package substrate. The package substrate also includes a removable memory mechanical interface disposed proximately to the memory device electrical interface. The removable memory mechanical interface is to allow a memory device to be easily removed from the package substrate after attachment of the memory device to the package substrate.

CPU package substrates with removable memory mechanical interfaces

An apparatus including a primary device and at least one secondary device coupled to a substrate; a heat exchanger disposed on the primary device and on the at least one secondary device, wherein the heat exchanger includes at least one portion disposed over an area corresponding to the primary device or the at least one second device including a deflectable surface; and at least one thermally conductive conduit coupled to the heat exchanger. A method including placing a heat exchanger on a multi-chip package, the heat exchanger including the heat exchanger including at least one floating section operable to move in a direction toward or away from at least one of the plurality of dice and at least one thermally conductive conduit disposed in a channel of the heat exchanger and connected to the at least one floating section; and coupling the heat exchanger to the multi-chip package.

Single base multi-floating surface cooling solution

Growing community of inventors

University Place, WA, United States of America

Mani Prakash