Samsung Electronics Co., Ltd.

Manho Kim

Kihuk Lee

Hwajoong Jung

Yonghwan Choi

Taeyun Kim

Youngseok Kim

Chiyoung Park

Taehwan Kim

Youngkwon Yoon

Hyungjin Rho

Kwangseok Byon

Youngsoo Jang

Byungkwon Kang

Changhoon Kim

Wonjun Jeong

Jongwan Shim

Keonyoung Seo

Kwangsic Choi

Sunhyoung Pyo

Jaemin Ryoo

Taehyuk Kim

Changhwan Jin

A camera module may include a camera housing, a camera assembly, at least a portion of which is accommodated in the camera housing, the camera assembly including a lens, an image sensor, and a first printed circuit board (PCB), and the camera assembly being coupled to the camera housing so as to be rotatable about a center of rotation of the camera assembly, a second printed circuit board, at least a portion of which is disposed in the camera housing to face the first printed circuit board, a first wireless communication module disposed on at least a portion of the first printed circuit board, and a second wireless communication module disposed on at least a portion of the second printed circuit board, and the first wireless communication module and the second wireless communication module wirelessly transmit and/or receive a signal related to the camera module. Other embodiments may be provided.

Camera module and electronic device comprising same

An electronic device includes a first housing including a first surface and a second surface; a second housing including a third surface and a fourth surface; a hinge structure; a camera module disposed within the first housing; and a first magnet disposed within the second housing and facing the camera module. The camera module includes: a case including one surface facing the first surface and the another surface facing the second surface and spaced apart from the first surface; a lens assembly movable within the case; and an actuator accommodating a second magnet and including a carrier configured to move the lens assembly in a direction toward the one surface of the case or a direction toward the other surface of the case; and the first magnet limits the movement of the lens assembly by interaction with the second magnet when the electronic device is in the folding state.

Electronic device including structure that reduces vibration in camera module

An electronic device is provided that includes a first housing, a second housing configured to be slidable from the first housing, and a main printed circuit board (PCB) disposed inside the first housing and including a processor mounted therein. The electronic device also includes a camera module disposed in the second housing, and a display module. The display module includes a display having a first region exposed externally and a second region within an internal space of the first housing, while in a slide-in state of the second housing. The display module also includes a first flexible PCB (FPCB) connected to the main PCB. At least a portion of the first FPCB is movable as the second housing slides out from the first housing. The camera module is electrically connected to the first FPCB to transmit and receive electrical signals to and from the processor mounted on the main PCB.

Electronic device including flexible display and camera

An electronic device is provided. The electronic device includes a first substrate on which a first electrical element and a first conductive structure, which is configured to surround the first electrical element, are disposed, a second substrate on which a second electrical element and a second conductive structure, which is separably connected to the first conductive structure, are disposed, and a connector which is disposed between the first substrate and the second substrate and electrically connects the first electrical element to the second electrical element.

Electronic device including structure for stacking substrates

An electronic device includes: a housing and a printed circuit board (PCB) structure disposed in the housing. The PCB structure includes a circuit board including an opening area formed through a first surface of the circuit board and a second surface of the circuit board opposite the first surface and a conductive pattern formed in a peripheral area around the opening area, a plate disposed on the second surface of the circuit board covering the opening area, an electronic element disposed on the plate and electrically connected with the circuit board, a resin portion disposed between the plate and the circuit board and extending from the conductive pattern, the resin portion including a conductive material, and a solder portion formed between the resin portion and the plate.

PCB structure and electronic device including the same

A flexible printed circuit board that includes a signal transmission part that is disposed in a first direction and that includes a signal line that transmits an electrical signal and a ground part disposed in a second direction. The ground part includes a conductive adhesive layer disposed in the first direction and the conductive adhesive layer includes a plurality of conductive balls having electrical conductivity. Various other embodiments are disclosed in the specification.

Flexible printed circuit board and electronic device including the same

An electronic device is provided. The electronic device includes a first image sensor, a second image sensor electrically connected to the first image sensor, and a processor operatively connected to the first image sensor and the second image sensor. The processor may be configured to generate first image data using the first image sensor and generate second image data using the second image sensor based on a synchronizing signal, transmit the second image data generated by the second image sensor to the first image sensor, and control the first image sensor to generate and output image data by processing the first image data and the second image data based on the synchronizing signal.

Image sensor and electronic device including the image sensor

A camera module is provided. The camera includes a circuit board to which an image sensor disposed is disposed, one or more first conductive portions at one or more regions of the circuit board, one or more elastic connectors, including an elastic member and a metal film surrounding at least part of an outer portion of the elastic member, the elastic connector is disposed on the first conductive region, a lens device including one or more lenses and a driver capable of moving the lens device, a housing which accommodates the lens device, and a second conductive portion in one or more regions of the housing. The housing may be disposed above the elastic connector such that the second conductive portion is electrically coupled to the first conductive portion due to a contact with the elastic connector.

Camera module having elasticity and mobile device with the same

An apparatus and method for a camera module is provided. The camera module includes a substrate, a first image sensor disposed in a first area on one side of the substrate, a second image sensor disposed in a second area on the one side, a reinforcement member disposed in an area around the first area and the second area so as to support at least a portion of the substrate, a first housing disposed in an area including at least a portion of the first area so as to be stacked on the first image sensor and one part of the reinforcement member while accommodating a first lens part corresponding to the first image sensor, and a second housing disposed in an area including at least a portion of the second area so as to be stacked on the second image sensor and the other part of the reinforcement member.

Camera module including reinforcement members for supporting printed circuit board on which plurality of image sensors are disposed and electronic device including the same

An electronic device that includes a circuit board which is arranged between a front cover and a back cover, and includes a conductive pattern inserted into the circuit board. A signal generation or power supply element is electrically connected with the conductive pattern. An adhesion layer is attached onto the circuit board and overlaps at least part of the conductive pattern when viewed from above the circuit board. A first structure is arranged on the adhesion layer and overlaps at least part of the adhesion layer when viewed from above the circuit board. A second structure is arranged on a top of the first structure, overlaps at least part of the first structure when viewed from above the circuit board, and the second structure includes a bottom surface including metal. A metal layer is inserted between the first structure and the bottom surface of the second structure to attach the second structure to the first structure.

Growing community of inventors

Suwon-si, South Korea

Manho Kim