Fraunhofer-gesellschaft Zur Foerderung Der Angewandten Forschung E.v.

Manfred Topfer

Herbert Reichl

Eberhard Kaulfersch

Stefan Weib

A chip arrangement has a first chip, a connecting device and at least a second chip or a substrate. The connecting device has a plurality of individual, spaced diamond parts which are arranged between the chips or between the first chip and the substrate and are connected to these such that the chips or the chip and the substrate are connected together via the diamond parts only. Methods for producing a chip arrangement of this kind comprise either the application of a diamond layer over the whole surface of the substrate and the subsequent structuring of the diamond layer to define individual, spaced diamond parts or the application of individual diamond parts to either the first chip or the second chip or the substrate such that they are arranged in spaced relationship with one another. The individual, spaced diamond parts are subsequently connected to the other component which is to be connected such that they are connected via the diamond parts only. A method of this kind is particularly suitable for connecting a high-power chip to a heat sink.

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Nauen, Germany

Manfred Topfer