Robert Boschgmbh

Manfred Spraul

Bernd Mueller

Carsten Gebauer

Thomas Ruzicka

Wolfgang Nuechter

Marc Dressler

In a method for operating a communication system having a plurality of nodes which have access to a shared channel, a transmission process for transmitting a message via the channel is monitored for bit errors, and when a bit error occurs, a signaling message is transmitted via the channel in order to signal the bit error. In order to allow communications processes between the nodes to be controlled as a function of a bit error rate of the channel, a signaling rate of the signaling messages is measured and a bit error rate of the channel is determined as a function of the signaling rate.

Method for operating a communication system having a plurality of nodes, and a communication system therefor

A data processing device and a method for error detection and error correction. The data processing device includes an error detection arrangement and an error correction arrangement. The error detection arrangement is able to detect correctable error and uncorrectable error in the data stored in a memory cell of the memory. The error detection arrangement then determines the neighboring memory cells or memory cells that are physically adjacent to the memory cell for which the correctable error was detected and generates a signal indicating a fault depending on the correctable errors detected in the neighboring physically adjacent memory cells. If a signal indicating a fault is not generated, then an error correction arrangement is used to correct the correctable error detected by the error detection arrangement.

Data processing device and a method for error detection and error correction

A method for mounting semiconductor chips on a substrate using flip-chip technology and a corresponding assembly are provided, which method includes the steps of: a) providing a semiconductor chip having a component region including components and an edge region, a mounting region containing a plurality of bonding pads being situated in the edge region; b) providing a substrate having a surface including a plurality of lands; c) applying soldering material to the bonding pads and/or to the lands; d) positioning the semiconductor chip on the substrate; and e) melting the soldering material by a soldering process in such a way that the mounting region of the semiconductor chip is moved towards the substrate due to the surface tension of the melting soldering material, and the component region is lifted away from the substrate by the resulting rotation around an axis of rotation or a pivot between the two regions.

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Stuttgart, Germany

Manfred Spraul