Tdk Electronics Ag

Epcos Ag

Manfred Schweinzger

Nele Reimer

Franz Rinner

Stefan Obermair

Thomas Feichtinger

Markus Koini

Christoph Auer

Johann Pichler

Yongli Wang

Pavol Dudesek

Hermann Grünbichler

Andreas Egger

Aniko Nagy

In an embodiment a method for producing a substrate includes forming a green sheet stack including first green sheets and second green sheets, wherein each of the first green sheets and the second green sheets contains a ceramic material as a main component, and wherein the second green sheets further contain a sintering aid in addition to the ceramic material.

Substrate and method for producing the substrate

A ceramic component and a method for manufacturing a ceramic component are disclosed. In an embodiment a ceramic component includes a ceramic base body and at least one metallization located an outer surface of the ceramic base body, wherein the metallization contains lithium vanadium phosphate having the general chemical formula LiV(PO), copper and glass, wherein a is a proportion of copper, b is a proportion of lithium vanadium phosphate and c is a proportion of glass which is contained in the metallization, wherein the following applies: 40 wt. %≤a≤99 wt. %, 1 wt. %≤b≤30 wt. %, 0 wt. %≤c≤20 wt. %, wherein x is a proportion of lithium, y is a proportion of vanadium and z is a proportion of phosphate in lithium vanadium phosphate, and wherein the following applies: 0<x, 0<y, 0<z.

Ceramic component and method for manufacturing the ceramic component

A polycrystalline ceramic solid and a method for producing a polycrystalline ceramic solid are disclosed. In an embodiment a polycrystalline ceramic solid includes a main phase with a composition of the general formula: (1-y)Pb(MgNb)O+yPbTiOwith 0.055&#x2264;y&#x2264;0.065, 0.95&#x2264;a&#x2264;1.02, 0.29&#x2264;b&#x2264;0.36, 0.63&#x2264;c&#x2264;0.69, 0.9&#x2264;d&#x2264;1.1, and 0&#x2264;e&#x2264;0.1, and optionally one or more secondary phases, wherein, in each section through the solid, a proportion of the secondary phases relative to any given cross-sectional area through the solid is less than or equal to 0.5 percent, or wherein the solid is free of the secondary phases.

Polycrystalline ceramic solid and method for producing a polycrystalline ceramic solid

An electronic device is disclosed. In an embodiment an electronic device includes at least one first carrier and at least one semiconductor chip, wherein the first carrier has a cavity in which the semiconductor chip is arranged.

Electronic device

An NTC ceramic part, an electronic component for inrush current limiting, and a method for manufacturing an electronic component are disclosed. In an embodiment, an NTC ceramic part for use in an electronic component for inrush current limiting is disclosed, wherein the NTC ceramic part has an electrical resistance in the m&#x3a9; range at a temperature of 25&#xb0; C. and/or at room temperature.

NTC ceramic part, electronic component for inrush current limiting, and method for manufacturing an electronic component

An overvoltage protection element and a method for producing an overvoltage protection element is disclosed. In an embodiment, the overvoltage protection element includes a first electrode, a second electrode and a discharge region arranged between the first electrode and the second electrode, wherein a porous discharge dielectric is arranged in the discharge region, and wherein the overvoltage protection element is configured to discharge a gas in pores of the discharge dielectric and produce an electrically conductive connection between the first electrode and the second electrode.

Overvoltage protection element and method for producing an overvoltage protection element

An NTC component comprising a first electrode () and a second electrode () is specified. The NTC component further comprises an NTC element () disposed between the first electrode () and the second electrode (), wherein the NTC element () comprises a ceramic having the general composition ABO, and where A and B each comprise one or more of the materials Mn, Ni, Co and Cu, and B additionally comprises one or more of the materials Fe, Y, Pr, Al, In, Ga and Sb.

NTC component and method for the production thereof

An electronic component is disclosed. In an embodiment, the electronic component includes a plurality of functional layers arranged one on top of the other forming a stack, first inner electrodes, and second inner electrodes, each of the first and second inner electrodes arranged between two adjacent functional layers. The electronic component further includes a first outer contact electrically connected to the first inner electrodes and a second outer contact electrically connected to the second inner electrodes, wherein the functional layers are selected such that the first and second outer contacts are electrically conductively connected to one another via the functional layers both in a basic state and in a hot state of the electronic component, wherein a temperature of the hot state is higher than a temperature of the basic state, and wherein the electronic component is an NTC component.

Growing community of inventors

Schwanberg, Austria

Manfred Schweinzger