Siemens Aktiengesellschaft

Manfred Schnoller

Horst Greiner

Konrad Reuschel

Karl Kempter

Ernst W Haas

Joachim Martin

Manfred Wohlfart

Friedrich Dannhauser

Jurgen Krausse

A method for dissolving a hardened glass solder, a method for separating components joined by a glass solder, a method for disassembling a fuel cell, and an apparatus for disassembling a fuel cell, include heating the hardened glass solder in a melt of a hydroxide. As a result, components which had been joined through the use of the hardened glass solder are able to be reused or subjected to a recycling process.

Method for dissolving a hardened glass solder, method for separating

In the present invention a process is provided for depositing a protective passivating film of doped or undoped amorphous silicon on a body of semiconductor material. In the process a body of semiconductor material is disposed within a reaction vessel, a silicon-hydrogen gaseous compound is fed into the reaction vessel and decomposed by means of a glow discharge. The decomposition of the silicon-hydrogen gas mixture results in the deposition of amorphous silicon on the semiconductor body.

Method for preparing a protective amorphous silicon passivating film on

A homogeneously doped p-conductive semiconductor material is produced by irradiating a desired semiconductor material with .gamma.-photons which trigger nuclear reactions within such irradiated material to form dopant atoms therein.

Method of producing homogeneously doped p-conductive semiconductor

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Haimhausen, Germany

Manfred Schnoller