Robert Boschgmbh

Manfred Reinold

Thomas Kaden

Immanuel Mueller

Dirk Brinkmann

Bjoern Erbe

Bernd Minkenberg

An electrical bond connection system between a first electrical contact surface and a second electrical contact surface having at least one first electrical conductor, which is bonded to at least one of the contact surfaces via at least one first bond connection. At least one additional second electrical conductor () is bonded to the first electrical conductor () via at least one second bond connection (), the two bond connections () being offset from one another. The present invention also relates to a method for manufacturing an electrical bond connection system existing between a first electrical contact surface and a second electrical contact surface.

Electrical bond connection system

A bond between two contact surfaces using at least two bonding wires, as well as a method for producing such a bond. The bonding wires are positioned one above the other and are conductively interconnected.

Bond and method for bonding two contact surfaces

A tool head for attaching an electrical conductor on the contact surface of a substrate, comprising a vibration exciter for generating linear ultrasonic vibrations; a bonding tool that is able to contact the contact surface and/or the conductor, a contact pressure being able to be applied to the conductor in the direction of the contact point via the bonding tool, and the conductor is able to be welded onto the contact point with the aid of the ultrasonic vibrations able to be transmitted to the contact point and/or the conductor in this manner; and a vibration conductor absorbing the linear ultrasonic vibrations of the vibration exciter; a converter being provided between the vibration conductor and the bonding tool to convert the linear vibrations into radial vibrations in such a way that the bonding tool is able to be incited to rotary vibrations.

Growing community of inventors

Schwieberdingen, Germany

Manfred Reinold