Robert Boschgmbh

Manfred Nitsch

Martin Maier

Peter Werner

Norbert Keim

Michael Horbelt

Juergen Graner

Herbert Arnold

Dieter Gunther

Willi Gansert

Willy Bentz

Dietrich Bergfried

Herbert Zimmermann

Josef Weber

Kurt Spitzenberger

Werner Auth

Wolfgang Leibfried

Fedor Modic

Ulrich Konzelmann

This invention is for holding components made of a ferromagnetic material parallel to a component axis for electroplating the component. The component substrate according to the invention has at least two magnet poles, oriented toward the components and having opposite polarity. The magnet field lines extend from one magnet pole to the other magnet pole through the components only in the vicinity of a contact faces of the components oriented toward the magnet poles. This prevents ferromagnetic particles from depositing on the ends of the components remote from the contact faces. The apparatus according to the invention is especially suitable for holding a plurality of components during electrolytic surface coating of the components.

Component substrate and method for holding a component made of

The flexible printed circuit device, includes at least one hybrid circuit structure having assigned contact areas, a rigid printed circuit board, a flexible printed circuit board portion also having assigned contact areas on one end region thereof and being connected electrically to the rigid printed circuit board, a plurality of bonding electrical conductors, each of the electrical conductors being bonded at one end thereof to one of the assigned contact areas on the at least one hybrid circuit structure and, at the other end thereof, to one of the assigned contact areas on the end region of the flexible printed circuit board portion; and a rigid support, the hybrid circuit structure being mounted on the rigid support. The end region of the flexible printed circuit board portion is fixedly mounted on the rigid support in side-by-side relationship with the hybrid circuit structure. A protective frame is provided enclosing the electrical conductors electrically connecting the assigned contact areas on the hybrid circuit structure and the end region of the flexible printed circuit board portion.

Flexible printed circuit connecting means for at least one hybrid

Very fine solder-coated conduction paths are made on ceramic, glass or enamel substrates by the combination of a first step in thick-film technology followed by the photo-masking and etching steps typical of thin-film technology, after which galvanic reinforcement of the initial calcined copper paste layer is performed in the locations where the initial layer is exposed by the developed mask. A lead-tin solder layer is then galvanically deposited, which is thicker than the mask, after which the mask is removed and the newly exposed portions of the initial copper layer are etched away. A reflow treatment of the solder layer pattern consolidates the solder layer by melting on top of the boundaries of the unetched initial copper layer. It is possible to obtain conduction path spacings down to 50 .mu.m with conduction paths coated with solder that have excellent adhesion to ceramic, glass or enamel substrates.

Process of producing galvanic layers of solder of precise contour on

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Schwieberdingen, Germany

Manfred Nitsch