Hid Global Corporation

Assa Abloy Ab

Smartrac I.p. B.v.

Linxens Holding Sas

Michalk, Manfred

Manfred Michalk

Martin Michalk

Sabine Nieland

Andreas Griesbach

Franziska Hofmann

Kay Hirschfeld

Martina Oehring

According to the method of stripping a portion of a wire of the invention, the insulated wire including the wire core are first flattened before the insulation is stripped away. The flattening eases the stripping as the insulation is partially cracked and dissociated of the wire core, and the stripping is more efficiently applied on a flat surface. A wire stripping machine and a transponder antenna with stripped portions are also claim as being part of the invention.

Method to strip a portion of an insulated wire

The invention relates to a device () for laminating a film-tape-like multilayer thermoplastic film arrangement (), according to the invention comprising heatable press plates () and cooling surfaces (), wherein a width of said press plates () and cooling surfaces () is greater than or equal to a width of the film arrangement (), wherein the film arrangement () is arranged in the position thereof relative to the press plates () such that press plate edges () lie at the grid center () and the cooling surfaces () are arranged with a distance up to 3 mm next to a press plate edge () and beginning in the same grid (), wherein a length of the cooling surfaces () is greater than or equal to a length of the press plates (), wherein one press plate () and one cooling surface () are respectively arranged on both sides of the film arrangement (), wherein the press plates () are fastened to press plate holding blocks () that can be moved or are supported by first press tables (), and wherein the cooling surfaces () are part of cooling blocks () that can be moved or are supported by second press tables (). The invention further relates to a multi-layer thermoplastic laminated film arrangement () and to a method for laminating a film-tape-like multilayer thermoplastic film arrangement ().

Multilayer thermoplastic laminated film arrangement and device and method for laminating

The invention refers to a method for manufacturing such a functional laminate, the method comprising the following steps: providing at least one patchwork layer; stacking the patchwork layer with at least one other layer in order to obtain a stack of layers, wherein at least one proximate layer directly adjacent to the patchwork layer comprises at least one zone comprising a first material or a second material; laminating the stack of layers together by heat and/or pressure and/or gluing.

Functional laminate

The present invention relates to a circuit arrangement () having a prescribed electrical capacitance, comprising a substrate (S) having at least one metallic, electrically conductive conductor (L, Lb, Ls). According to the invention, at least one first conductor strip segment (LA) is disposed on the substrate (S) and at least some regions of at least one second conductor strip segment (LA, LA, LA) are disposed on the first conductor strip segment (LA), wherein an electrically insulating layer (iS) is disposed between the conductor strip segments (LA, LA, LA, LA), forming a dielectric. The invention further relates to a method and a device () for producing a circuit arrangement () having a prescribed electrical capacitance.

Circuit configuration having a prescribed capacitance, and method and device for the production thereof

The transponder with an electronic unit comprising an antenna coil () connected to a chip module () embedded in a multi-layer laminate support () comprises at least one flexible thermoplastic layer () disposed on both sides of the electronic unit wherein the multi-layer laminate support further comprises a non-woven foil () with a grammage of less than 25 g/m.

Transponder embedded in a flexible multilayer support

The invention relates to a flat transponder having an electronic circuit which is arranged in a layer or in a layer composite and which contains at least one chip and conductor tracks or conductor wires, and also to a method for the production thereof. The invention is based on the object of specifying a transponder of the type mentioned at the beginning and a method for the production thereof which is flexible, has the most uniform thickness possible and can be bonded to further elements by means of water-based adhesives, its electronic components largely being protected against damage by bending and against being detected by feel. According to the invention, the object is achieved by a transponder in which the circuit is arranged in or on a circuit carrier () made of plastic, on whose two larger opposite outer surfaces a paper layer () applied by lamination is in each case applied.

Flat transponder and method for the production thereof

The method comprises the following steps: the substrate in the form of a one-piece basic substrate () is prepatterned into regions corresponding to future modules, pads of the semiconductor chip () are then contact-connected in predetermined regions of a first area of the basic substrate () and on the top side () of the prepatterned basic substrate () and on one area side of the semiconductor chip () a first adhesive layer () is applied, a second adhesive layer () is subsequently applied to the other area side of the semiconductor chip (), and a curing of the adhesive layers () and a final patterning of the metallic basic substrate () are then effected.

Method and arrangement for contact-connecting semiconductor chips on a metallic substrate

The invention relates to a method and device that make it possible to increase the productivity of the chip bonding and the before and after working steps associated with the chip bonding. To this end, the invention provides a method for contacting semiconductor chips () on a metallic substrate (), whereby an etch resist () is located at least on one substrate side, and semiconductor chips () are contacted on the contacting side () by means of flip-chip bonding processes, during which a contacting region () is created on the contacting side () of the substrate (). A semiconductor chip () having two contact bumps () is contacted on said contacting region in such a manner that: a contact bump () is contacted on both sides of a structure line () or of a structure trench () dividing the contacting region (), and; after the contacting, an underfilling of the chip () ensues after which an electrically insulating passage () is made in the contacting region (), and a module (), which supports the semiconductor chip (), is removed from the substrate ().

Growing community of inventors

Erfurt, Germany

Manfred Michalk